High Efficiency / High Frequency FET plus Driver Multi-chip Module with Internal Voltage Regulator

General Description The FDMF8704V is a fully optimized integrated Driver plus MOSFET power stage solution for high current synchronous buck DC-DC applications. The device integrates a driver IC and two Power MOSFETs into a space saving, MLP 8x8, 56-pin package. Features ■ 7V to 20V Input Voltag

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N-Channel 30V(D-S) Enhancement MOSFET

Application ? Load/Power switch ?Interfacing, logic switching ?Battery management for ultra protable: ?electronics

文件：1.05349 Mbytes 頁數(shù)：3 Pages

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N-Channel Enhancement MOSFET

Application o Load switch ? High Frequency Switching and Synchronous Rectification o Active Clamp in Intermediate ? DC/DC Power Supplies

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N-Channel Dual CoolTM Power Trench? SyncFETTM 30 V, 49 A, 1.9 m廓

Dual Cool? packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance ?exibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

文件：490.37 Kbytes 頁數(shù)：9 Pages

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DUAL COOL??PACKAGE POWERTRENCH? MOSFETs

Dual Cool? packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance ?exibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

文件：1.16337 Mbytes 頁數(shù)：2 Pages

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N-Channel Dual CoolTM PowerTrench? SyncFETTM 30 V, 49 A, 2.6 m廓

Dual Cool? packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance ?exibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

文件：348.15 Kbytes 頁數(shù)：9 Pages

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DUAL COOL??PACKAGE POWERTRENCH? MOSFETs

Dual Cool? packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance ?exibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

文件：1.16337 Mbytes 頁數(shù)：2 Pages

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DUAL COOL??PACKAGE POWERTRENCH? MOSFETs

Dual Cool? packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance ?exibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

文件：1.16337 Mbytes 頁數(shù)：2 Pages

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N-Channel Dual CoolTM PowerTrench MOSFET 30 V, 49 A, 6.0

Dual Cool? packaging technology, provides both bottom- and top-side cooling in a PQFN package. Not only is the PQFN footprint an industry standard, it provides the designer with performance ?exibility. With enhanced dual path thermal performance and improved parasitics over its wire-bonded predece

文件：435.23 Kbytes 頁數(shù)：8 Pages

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N-Channel Enhancement Mode MOSFET

Features + Advanced trench cell design + Low Thermal Resistance + Low Gate Charge

文件：5.91797 Mbytes 頁數(shù)：6 Pages

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