絲?。?a target="_blank" title="Marking" href="/c3f/marking.html">C3F；BIPOLAR ANALOG INTEGRATED CIRCUITS

FEATURES ? Supply voltage : VCC = 2.7 to 3.3 V ? Medium output power : μPC2762TB; PO(1 dB) = +8.0 dBm TYP. @ f = 0.9 GHz μPC2763TB; PO(1 dB) = +9.5 dBm TYP. @ f = 0.9 GHz μPC2771TB; PO(1 dB) = +11.5 dBm TYP. @ f = 0.9 GHz ? Power gain : μPC2762TB; GP = 13 dB TYP. @ f = 0.9 GHz μPC2763TB; GP

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絲印：C3F；BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES ? Supply voltage : VCC = 2.7 to 3.3 V ? Circuit current : ICC = 30 mA TYP. @ VCC = 3.0 V ? Medium output power : PO(1dB) = +9.5 dBm TYP. @ f = 0.9 GHz PO(1dB) = +9.0 dBm TYP. @ f = 1.9 GHz PO(1dB) = +8.0 dBm TYP. @ f = 2.4 GHz ? Power gain : GP = 21.5 dB TYP. @ f = 0.9 GHz GP = 20.

文件：327.58 Kbytes 頁數(shù)：19 Pages

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3 V, 2.9 GHz SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS

DESCRIPTION The μPC8182TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC operates at 3 V. The medium output power is suitable for RF-TX of mobile communications system. FEATURES ? Supply voltage: VCC = 2.7 to 3.3 V ? Circuit current: ICC = 3

文件：404.53 Kbytes 頁數(shù)：16 Pages

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3 V, 2.9 GHz SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS

DESCRIPTION The μPC8182TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC operates at 3 V. The medium output power is suitable for RF-TX of mobile communications system. FEATURES ? Supply voltage: VCC = 2.7 to 3.3 V ? Circuit current: ICC = 3

文件：404.53 Kbytes 頁數(shù)：16 Pages

NEC

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BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES ? High output frequency : fRFout = 0.8 to 2.5 GHz ? High-density surface mounting : 6-pin super minimold package ? Supply voltage : VCC = 2.7 to 3.3 V ? Higher IP3 : OIP3 = +10 dBm @ fRFout = 1.9 GHz

文件：419.18 Kbytes 頁數(shù)：34 Pages

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絲?。?a target="_blank" title="Marking" href="/c3g/marking.html">C3G；BIPOLAR ANALOG INTEGRATED CIRCUIT

FEATURES ? High output frequency : fRFout = 0.8 to 2.5 GHz ? High-density surface mounting : 6-pin super minimold package ? Supply voltage : VCC = 2.7 to 3.3 V ? Higher IP3 : OIP3 = +10 dBm @ fRFout = 1.9 GHz

文件：419.18 Kbytes 頁數(shù)：34 Pages

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BIPOLAR ANALOG INTEGRATED CIRCUITS

FEATURES ? RX-IF: 380 MHz, TX-IF: 570 MHz ? Low power consumption ? Built-in power saving function ? Small size: 20-pin plastic QFN package (3.2 ′ 4.2 ′ 0.8 mm)

文件：292.35 Kbytes 頁數(shù)：22 Pages

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BIPOLAR ANALOG INTEGRATED CIRCUITS

FEATURES ? RX-IF: 380 MHz, TX-IF: 570 MHz ? Low power consumption ? Built-in power saving function ? Small size: 20-pin plastic QFN package (3.2 ′ 4.2 ′ 0.8 mm)

文件：292.35 Kbytes 頁數(shù)：22 Pages

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BIPOLAR ANALOG INTEGRATED CIRCUITS

FEATURES ? RX-IF: 380 MHz, TX-IF: 570 MHz ? Low power consumption ? Built-in power-saving function ? Small size: 20-pin plastic LGA (CSP type) package (3 × 3 × 0.6 mm)

文件：499.44 Kbytes 頁數(shù)：28 Pages

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絲?。?a target="_blank" title="Marking" href="/8190/marking.html">8190；Package：LGA；BIPOLAR ANALOG INTEGRATED CIRCUITS

FEATURES ? RX-IF: 380 MHz, TX-IF: 570 MHz ? Low power consumption ? Built-in power-saving function ? Small size: 20-pin plastic LGA (CSP type) package (3 × 3 × 0.6 mm)

文件：499.44 Kbytes 頁數(shù)：28 Pages

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