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          首頁
                >FBP>規(guī)格書列表
                
          
            
          
                
          
                    
          型號下載 訂購功能描述制造商 上傳企業(yè)LOGO
          
                    
          FBP160808U600-3A
          MULTILAYER CHIP BEAD
          
●FEATURE
1. High current and multiple size availability
2. High reliability due to an entirely monolithic structure
3. Low DC resistance structure of electrode prevents wasteful electric power consumption
4. Suppress EMI/RFI and to prevent self-oscillation in electronic products

●APPLICATIO
          文件：197.91 Kbytes 頁數(shù)：4 Pages
          AITSEMI
          創(chuàng)瑞科技
          

          FBP160808U601-1A
          MULTILAYER CHIP BEAD
          
●FEATURE
1. High current and multiple size availability
2. High reliability due to an entirely monolithic structure
3. Low DC resistance structure of electrode prevents wasteful electric power consumption
4. Suppress EMI/RFI and to prevent self-oscillation in electronic products

●APPLICATIO
          文件：197.91 Kbytes 頁數(shù)：4 Pages
          AITSEMI
          創(chuàng)瑞科技
          

          FBP160808U601-2A
          MULTILAYER CHIP BEAD
          
●FEATURE
1. High current and multiple size availability
2. High reliability due to an entirely monolithic structure
3. Low DC resistance structure of electrode prevents wasteful electric power consumption
4. Suppress EMI/RFI and to prevent self-oscillation in electronic products

●APPLICATIO
          文件：197.91 Kbytes 頁數(shù)：4 Pages
          AITSEMI
          創(chuàng)瑞科技
          

          FBP160808U680-1A
          MULTILAYER CHIP BEAD
          
●FEATURE
1. High current and multiple size availability
2. High reliability due to an entirely monolithic structure
3. Low DC resistance structure of electrode prevents wasteful electric power consumption
4. Suppress EMI/RFI and to prevent self-oscillation in electronic products

●APPLICATIO
          文件：197.91 Kbytes 頁數(shù)：4 Pages
          AITSEMI
          創(chuàng)瑞科技
          

          FBP201209U102-1A
          MULTILAYER CHIP BEAD
          
●FEATURE
1. High current and multiple size availability
2. High reliability due to an entirely monolithic structure
3. Low DC resistance structure of electrode prevents wasteful electric power consumption
4. Suppress EMI/RFI and to prevent self-oscillation in electronic products

●APPLICATIO
          文件：197.91 Kbytes 頁數(shù)：4 Pages
          AITSEMI
          創(chuàng)瑞科技
          

          FBP201209U110-3A
          MULTILAYER CHIP BEAD
          
●FEATURE
1. High current and multiple size availability
2. High reliability due to an entirely monolithic structure
3. Low DC resistance structure of electrode prevents wasteful electric power consumption
4. Suppress EMI/RFI and to prevent self-oscillation in electronic products

●APPLICATIO
          文件：197.91 Kbytes 頁數(shù)：4 Pages
          AITSEMI
          創(chuàng)瑞科技
          

          FBP201209U121-3A
          MULTILAYER CHIP BEAD
          
●FEATURE
1. High current and multiple size availability
2. High reliability due to an entirely monolithic structure
3. Low DC resistance structure of electrode prevents wasteful electric power consumption
4. Suppress EMI/RFI and to prevent self-oscillation in electronic products

●APPLICATIO
          文件：197.91 Kbytes 頁數(shù)：4 Pages
          AITSEMI
          創(chuàng)瑞科技
          

          FBP201209U121-5A
          MULTILAYER CHIP BEAD
          
●FEATURE
1. High current and multiple size availability
2. High reliability due to an entirely monolithic structure
3. Low DC resistance structure of electrode prevents wasteful electric power consumption
4. Suppress EMI/RFI and to prevent self-oscillation in electronic products

●APPLICATIO
          文件：197.91 Kbytes 頁數(shù)：4 Pages
          AITSEMI
          創(chuàng)瑞科技
          

          FBP201209U170-3A
          MULTILAYER CHIP BEAD
          
●FEATURE
1. High current and multiple size availability
2. High reliability due to an entirely monolithic structure
3. Low DC resistance structure of electrode prevents wasteful electric power consumption
4. Suppress EMI/RFI and to prevent self-oscillation in electronic products

●APPLICATIO
          文件：197.91 Kbytes 頁數(shù)：4 Pages
          AITSEMI
          創(chuàng)瑞科技
          

          FBP201209U300-3A
          MULTILAYER CHIP BEAD
          
●FEATURE
1. High current and multiple size availability
2. High reliability due to an entirely monolithic structure
3. Low DC resistance structure of electrode prevents wasteful electric power consumption
4. Suppress EMI/RFI and to prevent self-oscillation in electronic products

●APPLICATIO
          文件：197.91 Kbytes 頁數(shù)：4 Pages
          AITSEMI
          創(chuàng)瑞科技
          

          
            
          
		
        
          
            
          
                
          產(chǎn)品屬性
          
            
          
            
            
            	
          • 產(chǎn)品編號：
            FBP
          • 制造商：
            SolaHD
          • 類別：
            變壓器 > 配件
          • 系列：
            SBE
          • 包裝：
            散裝
          • 配件類型：
            硬件套件
          • 描述：
            CC FUSE HOLDER+BASE+(2)WIRES
          
            
          
        
          
            
          供應(yīng)商型號品牌批號封裝庫存備注價格
          
                
          



          PRX
          		

          05+
          		

          原廠原裝
          		

          4350
          		

          只做全新原裝真實現(xiàn)貨供應(yīng)
          		
詢價
          

          



          MOTOROLA
          		

          24+
          		

          CAN3
          		

          1500
          		

          原裝現(xiàn)貨假一罰十
          		
詢價
          

          



          AP
          		

          24+
          		

          QFN
          		

          5000
          		

          全現(xiàn)原裝公司現(xiàn)貨
          		
詢價
          

          



          SOLA-HD
          		

          新
          		

          		

          5
          		

          全新原裝 貨期兩周
          		
詢價
          

          



          AP
          		

          QFN
          		

          6688
          		

          15
          		

          現(xiàn)貨庫存
          		
詢價
          

          



          MOTOROLA
          		

          專業(yè)鐵帽
          		

          CAN3
          		

          1500
          		

          原裝鐵帽專營,代理渠道量大可訂貨
          		
詢價
          

          



          FAG
          		

          23+
          		

          		

          65480
          		

          		
詢價
          

          



          SXSEMI
          		

          24+
          		

          DFN2
          		

          900000
          		

          原裝進(jìn)口特價
          		
詢價
          

          



          MOTOROLA/摩托羅拉
          		

          專業(yè)鐵帽
          		

          CAN3
          		

          67500
          		

          鐵帽原裝主營-可開原型號增稅票
          		
詢價
          

          



          SOLA-HD
          		

          2022+
          		

          		

          1
          		

          全新原裝 貨期兩周
          		
詢價
          

            
          
        
          
        
          更多FBP供應(yīng)商
            更新時間2026-1-19 16:28:00
        
          
        
          
          
          
            
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