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          首頁 >FBP>規(guī)格書列表

          型號下載 訂購功能描述制造商 上傳企業(yè)LOGO

          FBP

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          SMB15F23A

          絲?。?strong>FBP;Package:SMBFlat;1500 W TVS in SMB Flat

          Features ? Peak pulse power: 1500 W (10/1000 μs) and 10 kW (8/20 μs) ? Flat and thin package: 1 mm ? Stand-off voltage range: from 5 V to 64 V ? Unidirectional type ? Low leakage current: 0.2 μA at 25 °C and 1 μA at 85 °C ? Operating Tj max: 175 °C ? High power capability at Tj max.: 1100 W

          文件:598.84 Kbytes 頁數(shù):13 Pages

          STMICROELECTRONICS

          意法半導體

          FBP100505U100-2A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U102-0.25A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U102-0.3A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U102-0.5A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U121-2A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U221-0.7A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U221-1A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U600-0.3A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數(shù):4 Pages

          AITSEMI

          創(chuàng)瑞科技

          產(chǎn)品屬性

          • 產(chǎn)品編號:

            FBP

          • 制造商:

            SolaHD

          • 類別:

            變壓器 > 配件

          • 系列:

            SBE

          • 包裝:

            散裝

          • 配件類型:

            硬件套件

          • 描述:

            CC FUSE HOLDER+BASE+(2)WIRES

          供應商型號品牌批號封裝庫存備注價格
          PRX
          05+
          原廠原裝
          4350
          只做全新原裝真實現(xiàn)貨供應
          詢價
          MOTOROLA
          24+
          CAN3
          1500
          原裝現(xiàn)貨假一罰十
          詢價
          AP
          24+
          QFN
          5000
          全現(xiàn)原裝公司現(xiàn)貨
          詢價
          SOLA-HD
          5
          全新原裝 貨期兩周
          詢價
          AP
          QFN
          6688
          15
          現(xiàn)貨庫存
          詢價
          MOTOROLA
          專業(yè)鐵帽
          CAN3
          1500
          原裝鐵帽專營,代理渠道量大可訂貨
          詢價
          FAG
          23+
          65480
          詢價
          SXSEMI
          24+
          DFN2
          900000
          原裝進口特價
          詢價
          MOTOROLA/摩托羅拉
          專業(yè)鐵帽
          CAN3
          67500
          鐵帽原裝主營-可開原型號增稅票
          詢價
          SOLA-HD
          2022+
          1
          全新原裝 貨期兩周
          詢價
          更多FBP供應商 更新時間2026-1-19 16:28:00
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