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          首頁 >FBP>規(guī)格書列表

          型號下載 訂購功能描述制造商 上傳企業(yè)LOGO

          FBP100505U601-0.3A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數:4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP100505U601-0.5A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數:4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP160808U100-4A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數:4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP160808U121-1A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數:4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP160808U121-2.5A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數:4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP160808U121-2A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數:4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP160808U121-3A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數:4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP160808U271-1.2A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數:4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP160808U300-1A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數:4 Pages

          AITSEMI

          創(chuàng)瑞科技

          FBP160808U300-3A

          MULTILAYER CHIP BEAD

          ●FEATURE 1. High current and multiple size availability 2. High reliability due to an entirely monolithic structure 3. Low DC resistance structure of electrode prevents wasteful electric power consumption 4. Suppress EMI/RFI and to prevent self-oscillation in electronic products ●APPLICATIO

          文件:197.91 Kbytes 頁數:4 Pages

          AITSEMI

          創(chuàng)瑞科技

          產品屬性

          • 產品編號:

            FBP

          • 制造商:

            SolaHD

          • 類別:

            變壓器 > 配件

          • 系列:

            SBE

          • 包裝:

            散裝

          • 配件類型:

            硬件套件

          • 描述:

            CC FUSE HOLDER+BASE+(2)WIRES

          供應商型號品牌批號封裝庫存備注價格
          PRX
          05+
          原廠原裝
          4350
          只做全新原裝真實現貨供應
          詢價
          MOTOROLA
          24+
          CAN3
          1500
          原裝現貨假一罰十
          詢價
          AP
          24+
          QFN
          5000
          全現原裝公司現貨
          詢價
          SOLA-HD
          5
          全新原裝 貨期兩周
          詢價
          AP
          QFN
          6688
          15
          現貨庫存
          詢價
          MOTOROLA
          專業(yè)鐵帽
          CAN3
          1500
          原裝鐵帽專營,代理渠道量大可訂貨
          詢價
          FAG
          23+
          65480
          詢價
          SXSEMI
          24+
          DFN2
          900000
          原裝進口特價
          詢價
          MOTOROLA/摩托羅拉
          專業(yè)鐵帽
          CAN3
          67500
          鐵帽原裝主營-可開原型號增稅票
          詢價
          SOLA-HD
          2022+
          1
          全新原裝 貨期兩周
          詢價
          更多FBP供應商 更新時間2026-1-19 16:28:00
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