| 型號 | 下載 訂購 | 功能描述 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
Chip Inductors for Critical Applications Chip Inductors for Critical Applications ■ Higher inductance values than other 0603 inductors ■ Ferrite construction for high current handling ■ Inductance values: 47 nH – 22 μH; 5 and 2 tolerance 文件：199.38 Kbytes 頁數(shù)：2 Pages | COILCRAFT | COILCRAFT | ||
Chip Inductors for Critical Applications Chip Inductors for Critical Applications ■ Higher inductance values than other 0603 inductors ■ Ferrite construction for high current handling ■ Inductance values: 47 nH – 22 μH; 5 and 2 tolerance 文件：199.38 Kbytes 頁數(shù)：2 Pages | COILCRAFT | COILCRAFT | ||
Chip Inductors for Critical Applications Chip Inductors for Critical Applications ■ Higher inductance values than other 0603 inductors ■ Ferrite construction for high current handling ■ Inductance values: 47 nH – 22 μH; 5 and 2 tolerance 文件：199.38 Kbytes 頁數(shù)：2 Pages | COILCRAFT | COILCRAFT | ||
Chip Inductors for Critical Applications Chip Inductors for Critical Applications ■ Higher inductance values than other 0603 inductors ■ Ferrite construction for high current handling ■ Inductance values: 47 nH – 22 μH; 5 and 2 tolerance 文件：199.38 Kbytes 頁數(shù)：2 Pages | COILCRAFT | COILCRAFT | ||
Small Signal Transistor NPN - High Current Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 40 x 40 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 7.9 x 8.7 MILS Emitter Bonding Pad Area 9.0 x 14 MILS Top Side Metalization Al - 30,000? Back Side Metalization Au - 18,000? 文件：211.04 Kbytes 頁數(shù)：2 Pages | CENTRAL | CENTRAL | ||
NPN - High Current Transistor Chip PROCESS CP314V Small Signal Transistor NPN - High Current Transistor Chip 文件：463.1 Kbytes 頁數(shù)：2 Pages | CENTRAL | CENTRAL | ||
Power Transistors NPN - High Current Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 40 x 40 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 7.9 x 8.7 MILS Emitter Bonding Pad Area 9.0 x 14 MILS Top Side Metalization Al - 30,000? Back Side Metalization Au - 12,000? 文件：39.57 Kbytes 頁數(shù)：1 Pages | CENTRAL | CENTRAL | ||
Small Signal Transistor NPN - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 20 x 20 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 4.0 x 4.0 MILS Emitter Bonding Pad Area 4.7 x 4.7 MILS Top Side Metalization Al - 30,000? Back Side Metalization Au - 18,000? 文件：211.79 Kbytes 頁數(shù)：2 Pages | CENTRAL | CENTRAL | ||
Small Signal Transistors NPN - High Voltage Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 20 x 20 MILS Die Thickness 7.1 MILS Base Bonding Pad Area 4.0 x 4.0 MILS Emitter Bonding Pad Area 4.7 x 4.7 MILS Top Side Metalization Al - 30,000? Back Side Metalization Au - 18,000? 文件：193.04 Kbytes 頁數(shù)：2 Pages | CENTRAL | CENTRAL | ||
Small Signal Transistor NPN - RF Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 14.5 x 14.5 MILS Die Thickness 9.0 MILS Base Bonding Pad Area 2.4 x 2.2 MILS Emitter Bonding Pad Area 2.4 x 2.2 MILS Top Side Metalization 文件：181.49 Kbytes 頁數(shù)：2 Pages | CENTRAL | CENTRAL |
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
|---|---|---|---|---|---|---|---|
ON |
24+ |
SOT23 |
20000 |
一級代理原裝現(xiàn)貨假一罰十 |
詢價 | ||
ON/安森美 |
24+ |
SOT-23 |
2840 |
大批量供應(yīng)優(yōu)勢庫存熱賣 |
詢價 | ||
ON/安森美 |
23+ |
QFN33.16 |
9630 |
原廠原裝 |
詢價 | ||
ON |
22+ |
SOD-123 |
3000 |
原裝正品,支持實單 |
詢價 | ||
ON/安森美 |
23+ |
SOT-23 |
89630 |
當天發(fā)貨全新原裝現(xiàn)貨 |
詢價 | ||
NA |
25+ |
原廠原封可拆樣 |
54687 |
百分百原裝現(xiàn)貨 實單必成 |
詢價 | ||
ON |
24+/25+ |
645 |
原裝正品現(xiàn)貨庫存價優(yōu) |
詢價 | |||
ONSEMICONDU |
24+ |
原裝進口原廠原包接受訂貨 |
7800 |
原裝現(xiàn)貨假一罰十 |
詢價 | ||
ON |
1716+ |
? |
7500 |
只做原裝進口,假一罰十 |
詢價 | ||
SOD-123 |
23+ |
NA |
15659 |
振宏微專業(yè)只做正品,假一罰百! |
詢價 |
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