Surface Mount Chip LEDs

Description The MSL-174HR, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front P

文件：34.06 Kbytes 頁數：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-174SG, a SIGNAL GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting

文件：34.09 Kbytes 頁數：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-174SO, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front P

文件：33.91 Kbytes 頁數：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-174TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fro

文件：33.98 Kbytes 頁數：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-174UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting

文件：33.65 Kbytes 頁數：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-174UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlightin

文件：33.86 Kbytes 頁數：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-174UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front

文件：34.05 Kbytes 頁數：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-174UYL, a AMBER source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fron

文件：33.9 Kbytes 頁數：2 Pages

UOT

東貝光電

Surface Mount Chip LEDs

Description The MSL-174Y, a YELLOW source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pa

文件：34.5 Kbytes 頁數：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-1947HB3, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on Sapphire LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fron

文件：70.06 Kbytes 頁數：9 Pages

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東貝光電