Surface Mount Chip LEDs

Description The MSL-154UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlightin

文件：33.86 Kbytes 頁(yè)數(shù)：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-154UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front

文件：34.03 Kbytes 頁(yè)數(shù)：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-154UYL, a AMBER source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Fr

文件：33.88 Kbytes 頁(yè)數(shù)：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-154Y, a YELLOW source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pa

文件：34.47 Kbytes 頁(yè)數(shù)：2 Pages

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Surface Mount Full Color Chip LEDs

Description The MSL-157RGB , a full colors device, is made with InGaN ( on Sapphire substrate) BLUE, TRUE GREEN and AlInGaP SOFT RED LED dice. It is PCB type package, suitable for all SMT assembly methods. Features Key pad backlighting Symbol backlighting Front panel indicator

文件：41.52 Kbytes 頁(yè)數(shù)：3 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-174B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pane

文件：33.35 Kbytes 頁(yè)數(shù)：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-174BV, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on SiC LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel

文件：33.42 Kbytes 頁(yè)數(shù)：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-174DR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on GaAs LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pa

文件：34.39 Kbytes 頁(yè)數(shù)：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-174G, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel

文件：34.08 Kbytes 頁(yè)數(shù)：2 Pages

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東貝光電

Surface Mount Chip LEDs

Description The MSL-174HG, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package. Features Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Pane

文件：33.69 Kbytes 頁(yè)數(shù)：2 Pages

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