M14C04 Die Description

PRODUCT M14C04 ■ WAFER SIZE 152 mm (6 inches) ■ DIE IDENTIFICATION M14C04KA_R ■ DIE SIZE (X x Y) 1465 x 1585 μm ■ SCRIBE LINE 101.6 x 101.6 μm ■ PAD OPENING 100 x 100 μm DIE LAYOUT ■ DI

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M14C04 Die Description

ST

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Memory Card IC 16/4 Kbit Serial I?C Bus EEPROM

DESCRIPTION Each device is an electrically erasable program mable memory (EEPROM) fabricated with STMi croelectronics’s High Endurance, Single Polysilicon, CMOS technology. This guarantees an endurance typically well above one million Erase/Write cycles, with a data retention of 40 years. The m

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Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

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