絲印：K522；Package：SOT23-5；Rail-to-rail 1.8 V high-speed comparator

Features ? Propagation delay: 38 ns ? Low current consumption: 73 μA ? Rail-to-rail inputs ? Push-pull outputs ? Supply operation from 1.8 to 5 V ? Wide temperature range: -40 °C to 125 °C ? High ESD tolerance: 5 kV HBM, 300 V MM ? SMD packages ? Automotive qualification Applications

文件：610.09 Kbytes 頁數(shù)：16 Pages

STMICROELECTRONICS

意法半導體

絲印：K522；Package：SOT23-5；Rail-to-rail 1.8 V high-speed comparator

Features ? Propagation delay: 38 ns ? Low current consumption: 73 μA ? Rail-to-rail inputs ? Push-pull outputs ? Supply operation from 1.8 to 5 V ? Wide temperature range: -40 °C to 125 °C ? High ESD tolerance: 5 kV HBM, 300 V MM ? SMD packages ? Automotive qualification Applications

文件：993.33 Kbytes 頁數(shù)：17 Pages

STMICROELECTRONICS

意法半導體

MCP Specification

GENERAL DESCRIPTION The K522H1HACF is a Multi Chip Package Memory which combines 2G bit NAND Flash and 1G bit Mobile DDR synchronous Dynamic RAM. NAND cell provides the most cost-effective solution for the solid state application market. A program operation can be performed in typical 250μs on th

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