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    首頁
                >IRKL71>規(guī)格書列表
                
    
            
    
                
    
                    
    型號下載 訂購功能描述制造商 上傳企業(yè)LOGO
    
                    
    IRKL71SLASH06A
    THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR
    
Mechanical Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla
    文件：319.39 Kbytes 頁數(shù)：10 Pages
    IRF
    

    IRKL71SLASH06AS90
    THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR
    
Mechanical Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla
    文件：319.39 Kbytes 頁數(shù)：10 Pages
    IRF
    

    IRKL71SLASH08A
    THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR
    
Mechanical Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla
    文件：319.39 Kbytes 頁數(shù)：10 Pages
    IRF
    

    IRKL71SLASH08AS90
    THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR
    
Mechanical Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla
    文件：319.39 Kbytes 頁數(shù)：10 Pages
    IRF
    

    IRKL71SLASH10A
    THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR
    
Mechanical Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla
    文件：319.39 Kbytes 頁數(shù)：10 Pages
    IRF
    

    IRKL71SLASH10AS90
    THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR
    
Mechanical Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla
    文件：319.39 Kbytes 頁數(shù)：10 Pages
    IRF
    

    IRKL71SLASH12A
    THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR
    
Mechanical Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla
    文件：319.39 Kbytes 頁數(shù)：10 Pages
    IRF
    

    IRKL71SLASH12AS90
    THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR
    
Mechanical Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla
    文件：319.39 Kbytes 頁數(shù)：10 Pages
    IRF
    

    IRKL71SLASH14A
    THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR
    
Mechanical Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla
    文件：319.39 Kbytes 頁數(shù)：10 Pages
    IRF
    

    IRKL71SLASH14AS90
    THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR
    
Mechanical Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla
    文件：319.39 Kbytes 頁數(shù)：10 Pages
    IRF
    

    
            
    
		
        
    
            
    
                
    詳細(xì)參數(shù)
    
            
    
            
      
            	
    • 型號：
      IRKL71
    • 制造商：
      IRF 
    • 制造商全稱：
      International Rectifier 
    • 功能描述：
      THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR 
    
            
    
        
    
            
    供應(yīng)商型號品牌批號封裝庫存備注價(jià)格
    
                
    



    IR
    		

    22+
    		

    MODULE
    		

    6000
    		

    終端可免費(fèi)供樣,支持BOM配單
    		
詢價(jià)
    

    



    IR
    		

    23+
    		

    MODULE
    		

    8000
    		

    只做原裝現(xiàn)貨
    		
詢價(jià)
    

    



    IR
    		

    23+
    		

    MODULE
    		

    7000
    		

    		
詢價(jià)
    

    



    IR
    		

    25+
    		

    MODULE
    		

    64
    		

    就找我吧!--邀您體驗(yàn)愉快問購元件!
    		
詢價(jià)
    

    



    IR
    		

    2015
    		

    模塊
    		

    300
    		

    十七年VIP會(huì)員,誠信經(jīng)營，一手貨源，原裝正品可零售！
    		
詢價(jià)
    

    



    IR
    		

    2023+環(huán)?，F(xiàn)貨
    		

    模塊
    		

    50
    		

    專注軍工、汽車、醫(yī)療、工業(yè)等方案配套一站式服務(wù)
    		
詢價(jià)
    

    



    IR
    		

    		

    		

    100
    		

    原裝現(xiàn)貨,價(jià)格優(yōu)惠
    		
詢價(jià)
    

    



    IR
    		

    2015+
    		

    SMD/DIP
    		

    19889
    		

    一級代理原裝現(xiàn)貨,特價(jià)熱賣!
    		
詢價(jià)
    

    



    		

    23+
    		

    		

    10000
    		

    原廠授權(quán)一級代理,專業(yè)海外優(yōu)勢訂貨,價(jià)格優(yōu)勢、品種
    		
詢價(jià)
    

    



    原廠
    		

    2023+
    		

    模塊
    		

    600
    		

    專營模塊,繼電器,公司原裝現(xiàn)貨
    		
詢價(jià)
    

            
    
        
    
        
    更多IRKL71供應(yīng)商
            更新時(shí)間2026-1-22 14:00:00
        
    
        
    
          
    
            
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