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首頁(yè) >IRKL71>規(guī)格書列表

型號(hào)	下載訂購(gòu)	功能描述	制造商上傳企業(yè)	LOGO
IRKL71-10A	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 頁(yè)數(shù)：10 Pages	IRF	IRF
IRKL71-10AS90	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 頁(yè)數(shù)：10 Pages	IRF	IRF
IRKL71-12A	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 頁(yè)數(shù)：10 Pages	IRF	IRF
IRKL71-12AS90	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 頁(yè)數(shù)：10 Pages	IRF	IRF
IRKL71-14A	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 頁(yè)數(shù)：10 Pages	IRF	IRF
IRKL71-14AS90	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 頁(yè)數(shù)：10 Pages	IRF	IRF
IRKL71-16A	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 頁(yè)數(shù)：10 Pages	IRF	IRF
IRKL71-16AS90	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 頁(yè)數(shù)：10 Pages	IRF	IRF
IRKL71SLASH04A	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 頁(yè)數(shù)：10 Pages	IRF	IRF
IRKL71SLASH04AS90	文件：319.39 Kbytes Page：10 Pages	THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla 文件：319.39 Kbytes 頁(yè)數(shù)：10 Pages	IRF	IRF

詳細(xì)參數(shù)

型號(hào)：
IRKL71
制造商：
IRF
制造商全稱：
International Rectifier
功能描述：
THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

供應(yīng)商	型號(hào)	品牌	批號(hào)	封裝	庫(kù)存	備注	價(jià)格
深圳市河鋒鑫科技有限公司	IRKL71-08A	IR	22+	MODULE	6000	終端可免費(fèi)供樣,支持BOM配單	詢價(jià)
深圳市安富世紀(jì)電子有限公司	IRKL71-08A	IR	23+	MODULE	8000	只做原裝現(xiàn)貨	詢價(jià)
天津市博通航睿技術(shù)有限公司	IRKL71-08A	IR	23+	MODULE	7000		詢價(jià)
深圳市科雨電子有限公司	IRKL71-10	IR	25+	MODULE	64	就找我吧!--邀您體驗(yàn)愉快問(wèn)購(gòu)元件!	詢價(jià)
深圳市誠(chéng)利順電子科技有限公司	IRKL71-10	IR	2015	模塊	300	十七年VIP會(huì)員,誠(chéng)信經(jīng)營(yíng)，一手貨源，原裝正品可零售！	詢價(jià)
深圳龐田科技有限公司	IRKL71-10	IR	2023+環(huán)保現(xiàn)貨	模塊	50	專注軍工、汽車、醫(yī)療、工業(yè)等方案配套一站式服務(wù)	詢價(jià)
深圳市勤思達(dá)科技有限公司	IRKL71-12	IR			100	原裝現(xiàn)貨,價(jià)格優(yōu)惠	詢價(jià)
深圳市福田區(qū)綠盛電子商行	IRKL71-12	IR	2015+	SMD/DIP	19889	一級(jí)代理原裝現(xiàn)貨,特價(jià)熱賣!	詢價(jià)
貿(mào)澤芯城（深圳）電子科技有限公司	IRKL71-12		23+		10000	原廠授權(quán)一級(jí)代理,專業(yè)海外優(yōu)勢(shì)訂貨,價(jià)格優(yōu)勢(shì)、品種	詢價(jià)
華富測(cè)量(深圳)傳感技術(shù)有限公司	IRKL71-12	原廠	2023+	模塊	600	專營(yíng)模塊,繼電器,公司原裝現(xiàn)貨	詢價(jià)

更多IRKL71供應(yīng)商更新時(shí)間2026-1-22 14:00:00

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