| 型號(hào) | 下載 訂購(gòu) | 功能描述 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁(yè)數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁(yè)數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁(yè)數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁(yè)數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁(yè)數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Half Bridge IGBT Module The Powerline range of modules includes half bridge, chopper, dual and single switch configurations covering voltages from 600V to 3300V and currents up to 2400A. The GP250MHB06S is a half bridge 600V n channel enhancement mode insulated gate bipolar transistor (IGBT) module. The module is suitab 文件：127.82 Kbytes 頁(yè)數(shù)：10 Pages | DYNEX | DYNEX | ||
RELAY - LATCH 2 PDT, 2 AMP 文件：517.24 Kbytes 頁(yè)數(shù)：9 Pages | ETCList of Unclassifed Manufacturers 未分類(lèi)制造商 | ETC | ||
RELAY - LATCH 2 PDT, 2 AMP 文件：517.24 Kbytes 頁(yè)數(shù)：9 Pages | ETCList of Unclassifed Manufacturers 未分類(lèi)制造商 | ETC | ||
RELAY - LATCH 2 PDT, 2 AMP 文件：517.24 Kbytes 頁(yè)數(shù)：9 Pages | ETCList of Unclassifed Manufacturers 未分類(lèi)制造商 | ETC | ||
RELAY - LATCH 2 PDT, 2 AMP 文件：517.24 Kbytes 頁(yè)數(shù)：9 Pages | ETCList of Unclassifed Manufacturers 未分類(lèi)制造商 | ETC |
技術(shù)參數(shù)
- VRRM_Max (V)：
600
- IF(AV)_Max(A)：
25
- IFSM_Max @ tP = 8.3ms (A)：
350
- IR_Max (μA)：
5
- @ VDC (V)：
600
- VF_Max (V)：
1.2
- @ IF (A)：
25
- CJ_Typ (pF)：
150
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫(kù)存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
固派電子 |
16+ |
NA |
8800 |
原裝現(xiàn)貨,貨真價(jià)優(yōu) |
詢(xún)價(jià) | ||
23+ |
自恢復(fù)保險(xiǎn)絲 |
50000 |
全新原裝正品現(xiàn)貨,支持訂貨 |
詢(xún)價(jià) | |||
Bergquist |
22+ |
NA |
4 |
加我QQ或微信咨詢(xún)更多詳細(xì)信息, |
詢(xún)價(jià) | ||
捷捷微 |
23+ |
TO-220F-2L |
30000 |
原廠授權(quán)一級(jí)代理,專(zhuān)業(yè)海外優(yōu)勢(shì)訂貨,價(jià)格優(yōu)勢(shì)、品種 |
詢(xún)價(jià) | ||
19+ |
自恢復(fù)保險(xiǎn)絲 |
58 |
一級(jí)代理,專(zhuān)注軍工、汽車(chē)、醫(yī)療、工業(yè)、新能源、電力 |
詢(xún)價(jià) | |||
JST/日壓 |
23+ |
NA/原裝 |
117000 |
代理-優(yōu)勢(shì)-原裝-正品-現(xiàn)貨*期貨 |
詢(xún)價(jià) | ||
VISHAY |
23+ |
標(biāo)準(zhǔn)封裝 |
5000 |
原廠授權(quán)一級(jí)代理 IGBT模塊 可控硅 晶閘管 熔斷器質(zhì)保 |
詢(xún)價(jià) | ||
固派電子 |
05+ |
1249 |
優(yōu)勢(shì)貨源原裝正品 |
詢(xún)價(jià) | |||
固派電子 |
24+ |
8000 |
原裝現(xiàn)貨,特價(jià)銷(xiāo)售 |
詢(xún)價(jià) | |||
捷捷微 |
24+ |
TO-220C-2L |
50000 |
只做原裝，歡迎詢(xún)價(jià)，量大價(jià)優(yōu) |
詢(xún)價(jià) |
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