| 型號(hào) | 下載 訂購 | 功能描述 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁數(shù)：1 Pages | HENKEL 漢高 | HENKEL | ||
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits ? Thermal conductivity: 2.4 W/m-K ? Low “S-Class” thermal resistance at ultra-low pressures ? Ultra conformable,“gel-like” modulus ? Designed for low-stress applications ? Fiberglass reinforced for puncture, shear and tear resistance 文件：77.12 Kbytes 頁數(shù)：1 Pages | HENKEL 漢高 | HENKEL |
技術(shù)參數(shù)
- VRRM_Max (V)：
600
- IF(AV)_Max(A)：
25
- IFSM_Max @ tP = 8.3ms (A)：
350
- IR_Max (μA)：
5
- @ VDC (V)：
600
- VF_Max (V)：
1.2
- @ IF (A)：
25
- CJ_Typ (pF)：
150
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
固派電子 |
16+ |
NA |
8800 |
原裝現(xiàn)貨,貨真價(jià)優(yōu) |
詢價(jià) | ||
23+ |
自恢復(fù)保險(xiǎn)絲 |
50000 |
全新原裝正品現(xiàn)貨,支持訂貨 |
詢價(jià) | |||
Bergquist |
22+ |
NA |
4 |
加我QQ或微信咨詢更多詳細(xì)信息, |
詢價(jià) | ||
捷捷微 |
23+ |
TO-220F-2L |
30000 |
原廠授權(quán)一級(jí)代理,專業(yè)海外優(yōu)勢(shì)訂貨,價(jià)格優(yōu)勢(shì)、品種 |
詢價(jià) | ||
19+ |
自恢復(fù)保險(xiǎn)絲 |
58 |
一級(jí)代理,專注軍工、汽車、醫(yī)療、工業(yè)、新能源、電力 |
詢價(jià) | |||
JST/日壓 |
23+ |
NA/原裝 |
117000 |
代理-優(yōu)勢(shì)-原裝-正品-現(xiàn)貨*期貨 |
詢價(jià) | ||
VISHAY |
23+ |
標(biāo)準(zhǔn)封裝 |
5000 |
原廠授權(quán)一級(jí)代理 IGBT模塊 可控硅 晶閘管 熔斷器質(zhì)保 |
詢價(jià) | ||
固派電子 |
05+ |
1249 |
優(yōu)勢(shì)貨源原裝正品 |
詢價(jià) | |||
固派電子 |
24+ |
8000 |
原裝現(xiàn)貨,特價(jià)銷售 |
詢價(jià) | |||
捷捷微 |
24+ |
TO-220C-2L |
50000 |
只做原裝，歡迎詢價(jià)，量大價(jià)優(yōu) |
詢價(jià) |
相關(guān)規(guī)格書
更多- NE5532
- NE5532
- NE5532
- NE5532
- NE5532
- NE5532A
- NE5532A
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- MAX232
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- SI7964DP
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- SPC5605BF1MLQ6
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- WNS40H100CG
- MPC8540PX833LC
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- TD62308BP1G
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- TL074
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相關(guān)庫存
更多- NE5532
- NE5532
- NE5532
- NE5532
- NE5532A
- NE5532-TD
- NE5532NB
- MAX232
- MAX232
- MAX232
- MAX232A
- MAX2323
- MAX2326
- MAX2327
- MAX232E
- MAX232E
- MAX232ESE
- NE5533
- SI7970DP
- SI7958DP
- SI7913DN
- SI7942DP
- SI7911DN
- SI7900EDN
- SI7922DN
- SI7946DP
- SI7945DP
- SI7921DN
- SI7905DN
- SI7938DP
- SI7925DN
- SI7948DP
- SI7946ADP
- SE1
- PI7C8150B
- PI7C8150DNDE
- PERICOMPI7C8150
- WNS40H100C
- WNS40H100CB
- TD62308
- TD62308APG
- TD62308AFG
- GRM21BR71H104JA11#
- TL074
- TL074
