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    首頁 >GC1>規(guī)格書列表

    型號下載 訂購功能描述制造商 上傳企業(yè)LOGO

    GC11N70F

    絲?。?a target="_blank" title="Marking" href="/gc11n70/marking.html">GC11N70;Package:TO-220F;N-Channel Enhancement Mode Power MOSFET

    Description The GC11N70F uses advanced trench technology to provide excellent RDS(ON) , low gate charge. It can be used in a wide variety of applications. Application l Power switch l DC/DC converters

    文件:765.67 Kbytes 頁數(shù):6 Pages

    GOFORD

    谷峰半導(dǎo)體

    GC11N70F

    絲?。?a target="_blank" title="Marking" href="/gc11n70/marking.html">GC11N70;Package:TO-220F;Power Factor Correction (PFC)

    Description The GC11N70 uses advanced super junction technology and design to provide excellent RDS(ON) and low gate charge. This device is suitable for industry AC-DC SMPS requirement of PFC, AC/DC power conversion, and other industrial power application. Application ● Power Factor Corre

    文件:2.47652 Mbytes 頁數(shù):9 Pages

    GOFORD

    谷峰半導(dǎo)體

    GC11N70J

    絲?。?a target="_blank" title="Marking" href="/gc11n70/marking.html">GC11N70;Package:TO-251;Power Factor Correction (PFC)

    Description The GC11N70 uses advanced super junction technology and design to provide excellent RDS(ON) and low gate charge. This device is suitable for industry AC-DC SMPS requirement of PFC, AC/DC power conversion, and other industrial power application. Application ● Power Factor Corre

    文件:2.47652 Mbytes 頁數(shù):9 Pages

    GOFORD

    谷峰半導(dǎo)體

    GC11N70K

    絲印:GC11N70;Package:TO-252;Power Factor Correction (PFC)

    Description The GC11N70 uses advanced super junction technology and design to provide excellent RDS(ON) and low gate charge. This device is suitable for industry AC-DC SMPS requirement of PFC, AC/DC power conversion, and other industrial power application. Application ● Power Factor Corre

    文件:2.47652 Mbytes 頁數(shù):9 Pages

    GOFORD

    谷峰半導(dǎo)體

    GC11N70T

    絲?。?a target="_blank" title="Marking" href="/gc11n70/marking.html">GC11N70;Package:TO-220;Power Factor Correction (PFC)

    Description The GC11N70 uses advanced super junction technology and design to provide excellent RDS(ON) and low gate charge. This device is suitable for industry AC-DC SMPS requirement of PFC, AC/DC power conversion, and other industrial power application. Application ● Power Factor Corre

    文件:2.47652 Mbytes 頁數(shù):9 Pages

    GOFORD

    谷峰半導(dǎo)體

    GC120N65QF

    絲?。?a target="_blank" title="Marking" href="/gc120n65/marking.html">GC120N65;Package:TO-247;N-Channel Enhancement Mode Power MOSFET

    Description The GC120N65QF uses advanced trench technology to provide excellent RDS(ON) , low gate charge. It can be used in a wide variety of applications. Application l Power switch l DC/DC converters

    文件:1.14606 Mbytes 頁數(shù):6 Pages

    GOFORD

    谷峰半導(dǎo)體

    GC125N65FF

    絲?。?a target="_blank" title="Marking" href="/gc125n65f/marking.html">GC125N65F;Package:TO-220F;N-Channel Enhancement Mode Power MOSFET

    Description The GC125N65FF uses advanced trench technology to provide excellent RDS(ON) , low gate charge. It can be used in a wide variety of applications. Application l Power switch l DC/DC converters

    文件:970.83 Kbytes 頁數(shù):6 Pages

    GOFORD

    谷峰半導(dǎo)體

    GC1300

    ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

    DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

    文件:290.19 Kbytes 頁數(shù):4 Pages

    MICROSEMI

    美高森美

    GC1301

    ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

    DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

    文件:290.19 Kbytes 頁數(shù):4 Pages

    MICROSEMI

    美高森美

    GC1302

    ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

    DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

    文件:290.19 Kbytes 頁數(shù):4 Pages

    MICROSEMI

    美高森美

    詳細參數(shù)

    • 型號:

      GC1

    • 制造商:

      MICROSEMI

    • 制造商全稱:

      Microsemi Corporation

    • 功能描述:

      CONTROL DEVICES 30 Volt Abrupt Junction Tuning Varactors

    供應(yīng)商型號品牌批號封裝庫存備注價格
    Microchip
    2022+
    原廠原包裝
    8600
    全新原裝 支持表配單 中國著名電子元器件獨立分銷
    詢價
    MICROCHIP
    23+
    7300
    專注配單,只做原裝進口現(xiàn)貨
    詢價
    24+
    N/A
    67000
    一級代理-主營優(yōu)勢-實惠價格-不悔選擇
    詢價
    甘特
    22+
    DIP
    6080
    22+
    詢價
    COMUS
    23+
    DIP
    50000
    全新原裝正品現(xiàn)貨,支持訂貨
    詢價
    COMUS
    2026+
    DIP
    54658
    百分百原裝現(xiàn)貨 實單必成
    詢價
    GUNTHER
    24+
    DIP
    60000
    詢價
    Herotek
    24+
    模塊
    400
    詢價
    GC
    23+
    DIPSOP
    3145
    一級代理原廠VIP渠道,專注軍工、汽車、醫(yī)療、工業(yè)、
    詢價
    GeneSiC Semiconductor
    25+
    TO-220-2
    9350
    獨立分銷商 公司只做原裝 誠心經(jīng)營 免費試樣正品保證
    詢價
    更多GC1供應(yīng)商 更新時間2026-1-22 15:01:00

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