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首頁 >CAA572>規(guī)格書列表

型號(hào)	下載訂購	功能描述	制造商上傳企業(yè)	LOGO
CAA572C0G2A225J670LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie 文件：416.33 Kbytes 頁數(shù)：6 Pages	TDK 東電化	TDK
CAA572C0G2A225M640LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie 文件：416.33 Kbytes 頁數(shù)：6 Pages	TDK 東電化	TDK
CAA572C0G2A225M670LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie 文件：416.33 Kbytes 頁數(shù)：6 Pages	TDK 東電化	TDK
CAA572C0G2J0R5G640LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie 文件：416.33 Kbytes 頁數(shù)：6 Pages	TDK 東電化	TDK
CAA572C0G2J0R5G670LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie 文件：416.33 Kbytes 頁數(shù)：6 Pages	TDK 東電化	TDK
CAA572C0G2J0R5J640LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie 文件：416.33 Kbytes 頁數(shù)：6 Pages	TDK 東電化	TDK
CAA572C0G2J0R5J670LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie 文件：416.33 Kbytes 頁數(shù)：6 Pages	TDK 東電化	TDK
CAA572C0G2J0R5M640LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie 文件：416.33 Kbytes 頁數(shù)：6 Pages	TDK 東電化	TDK
CAA572C0G2J0R5M670LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie 文件：416.33 Kbytes 頁數(shù)：6 Pages	TDK 東電化	TDK
CAA572C0G2J101G640LJ	文件：416.33 Kbytes Page：6 Pages	MULTILAYER CERAMIC CHIP CAPACITORS ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie 文件：416.33 Kbytes 頁數(shù)：6 Pages	TDK 東電化	TDK

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技術(shù)參數(shù)

額定電壓：
630VDC
溫度特性?：
C0G(0±30ppm/°C)
Q (Min.)：
1000
絕緣電阻 (Min.)：
2500MΩ

供應(yīng)商	型號(hào)	品牌	批號(hào)	封裝	庫存	備注	價(jià)格
深圳市顯勝光電科技有限公司	CAA572X7T2V225M640LJ	TDK			100000		詢價(jià)
北京天陽誠業(yè)科貿(mào)有限公司	CAA572X7T2V225M640LH	TDK	24+	con	35960	查現(xiàn)貨到京北通宇商城	詢價(jià)
萬三科技(深圳)有限公司	CAA572X7S2A336M640LH	TDK(東電化)	25+	封裝	500000	源自原廠成本,高價(jià)回收工廠呆滯	詢價(jià)
深圳市小澤科技電子有限公司	CAA572X7R1E107M670LH	TDK/東電化	25+	SMD	2640000	QQ全天詢價(jià)/耐高溫/防斷裂專營日系/支持小批量	詢價(jià)
深圳市高捷芯城科技有限公司	CAA572C0G3A443J640LJ	TDK	25+	N/A	23458	樣件支持,可原廠排單訂貨!	詢價(jià)
深圳市得捷芯城科技有限公司	CAA572X7S2A336M640LH	TDK(東電化)	25+	N/A	23510	正規(guī)渠道,免費(fèi)送樣。支持賬期,BOM一站式配齊	詢價(jià)

更多CAA572供應(yīng)商更新時(shí)間2026-1-20 9:32:00

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