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          首頁 >CAA572>規(guī)格書列表

          型號下載 訂購功能描述制造商 上傳企業(yè)LOGO

          CAA572C0G1H0R5G670LJ

          MULTILAYER CERAMIC CHIP CAPACITORS

          ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie

          文件:416.33 Kbytes 頁數(shù):6 Pages

          TDK

          東電化

          CAA572C0G1H0R5J640LJ

          MULTILAYER CERAMIC CHIP CAPACITORS

          ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie

          文件:416.33 Kbytes 頁數(shù):6 Pages

          TDK

          東電化

          CAA572C0G1H0R5J670LJ

          MULTILAYER CERAMIC CHIP CAPACITORS

          ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie

          文件:416.33 Kbytes 頁數(shù):6 Pages

          TDK

          東電化

          CAA572C0G1H0R5M640LJ

          MULTILAYER CERAMIC CHIP CAPACITORS

          ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie

          文件:416.33 Kbytes 頁數(shù):6 Pages

          TDK

          東電化

          CAA572C0G1H0R5M670LJ

          MULTILAYER CERAMIC CHIP CAPACITORS

          ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie

          文件:416.33 Kbytes 頁數(shù):6 Pages

          TDK

          東電化

          CAA572C0G1H101G640LJ

          MULTILAYER CERAMIC CHIP CAPACITORS

          ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie

          文件:416.33 Kbytes 頁數(shù):6 Pages

          TDK

          東電化

          CAA572C0G1H101G670LJ

          MULTILAYER CERAMIC CHIP CAPACITORS

          ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie

          文件:416.33 Kbytes 頁數(shù):6 Pages

          TDK

          東電化

          CAA572C0G1H101J640LJ

          MULTILAYER CERAMIC CHIP CAPACITORS

          ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie

          文件:416.33 Kbytes 頁數(shù):6 Pages

          TDK

          東電化

          CAA572C0G1H101J670LJ

          MULTILAYER CERAMIC CHIP CAPACITORS

          ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie

          文件:416.33 Kbytes 頁數(shù):6 Pages

          TDK

          東電化

          CAA572C0G1H101M640LJ

          MULTILAYER CERAMIC CHIP CAPACITORS

          ■FEATURES ?Unique structure achieves high capacitance, high reliability and low resistance. ?Metal frame relieves mechanical stress and thermal shock. ?Because MLCCs and metal frames are joined with both high-temperature solder and clamps, the risk of MLCC fall during reflow reduces. ?Qualifie

          文件:416.33 Kbytes 頁數(shù):6 Pages

          TDK

          東電化

          技術(shù)參數(shù)

          • 額定電壓:

            630VDC

          • 溫度特性?:

            C0G(0±30ppm/°C)

          • Q (Min.):

            1000

          • 絕緣電阻 (Min.):

            2500MΩ

          供應(yīng)商型號品牌批號封裝庫存備注價(jià)格
          TDK
          100000
          詢價(jià)
          TDK
          24+
          con
          35960
          查現(xiàn)貨到京北通宇商城
          詢價(jià)
          TDK(東電化)
          25+
          封裝
          500000
          源自原廠成本,高價(jià)回收工廠呆滯
          詢價(jià)
          TDK/東電化
          25+
          SMD
          2640000
          QQ全天詢價(jià)/耐高溫/防斷裂 專營日系/支持小批量
          詢價(jià)
          TDK
          25+
          N/A
          23458
          樣件支持,可原廠排單訂貨!
          詢價(jià)
          TDK(東電化)
          25+
          N/A
          23510
          正規(guī)渠道,免費(fèi)送樣。支持賬期,BOM一站式配齊
          詢價(jià)
          更多CAA572供應(yīng)商 更新時(shí)間2026-1-17 9:32:00
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