| 型號 | 下載 訂購 | 功能描述 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
2.00mm (.079) Pitch Crimp Housing, Single Row, 16 Circuits 文件：100.8 Kbytes 頁數(shù)：2 Pages | MOLEX 莫仕 | MOLEX | ||
絲?。?a target="_blank" title="Marking" href="/87312e/marking.html">87312E；Package：VSON；Dual 30-V N-Channel NexFET? Power MOSFETs 1FEATURES ? Common Source Connection ? Ultra Low Drain to Drain On-Resistance ? Space Saving SON 3.3 x 3.3mm Plastic Package ? Optimized for 5V Gate Drive ? Low Thermal Resistance ? Avalanche Rated ? Pb Free Terminal Plating ? RoHS Compliant ? Halogen Free APPLICATIONS ? Adaptor/USB 文件：536.83 Kbytes 頁數(shù)：15 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/87312e/marking.html">87312E；Package：VSON；Dual 30-V N-Channel NexFET? Power MOSFETs 1FEATURES ? Common Source Connection ? Ultra Low Drain to Drain On-Resistance ? Space Saving SON 3.3 x 3.3mm Plastic Package ? Optimized for 5V Gate Drive ? Low Thermal Resistance ? Avalanche Rated ? Pb Free Terminal Plating ? RoHS Compliant ? Halogen Free APPLICATIONS ? Adaptor/USB 文件：536.83 Kbytes 頁數(shù)：15 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/87330d/marking.html">87330D；Package：VSON-CLIP；CSD87330Q3D Synchronous Buck NexFET? Power Block 1 Features 1? Half-Bridge Power Block ? Up to 27-V VIN ? 90% System Efficiency at 15 A ? Up to 20-A Operation ? High-Frequency Operation (Up to 1.5 MHz) ? High-Density SON 3.3-mm × 3.3-mm Footprint ? Optimized for 5-V Gate Drive ? Low-Switching Losses ? Ultra-Low Inductance Package ? 文件：637.48 Kbytes 頁數(shù)：24 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/87330d/marking.html">87330D；Package：VSON-CLIP(DPB)；CSD87330Q3D Synchronous Buck NexFET? Power Block 1 Features 1? Half-Bridge Power Block ? Up to 27-V VIN ? 90% System Efficiency at 15 A ? Up to 20-A Operation ? High-Frequency Operation (Up to 1.5 MHz) ? High-Density SON 3.3-mm × 3.3-mm Footprint ? Optimized for 5-V Gate Drive ? Low-Switching Losses ? Ultra-Low Inductance Package ? 文件：637.9 Kbytes 頁數(shù)：24 Pages | TI 德州儀器 | TI | ||
絲印：87330D；Package：VSON-CLIP(DPB)；CSD87330Q3D Synchronous Buck NexFET? Power Block 1 Features 1? Half-Bridge Power Block ? Up to 27-V VIN ? 90% System Efficiency at 15 A ? Up to 20-A Operation ? High-Frequency Operation (Up to 1.5 MHz) ? High-Density SON 3.3-mm × 3.3-mm Footprint ? Optimized for 5-V Gate Drive ? Low-Switching Losses ? Ultra-Low Inductance Package ? 文件：637.9 Kbytes 頁數(shù)：24 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/87330d/marking.html">87330D；Package：VSON-CLIP；CSD87330Q3D Synchronous Buck NexFET? Power Block 1 Features 1? Half-Bridge Power Block ? Up to 27-V VIN ? 90% System Efficiency at 15 A ? Up to 20-A Operation ? High-Frequency Operation (Up to 1.5 MHz) ? High-Density SON 3.3-mm × 3.3-mm Footprint ? Optimized for 5-V Gate Drive ? Low-Switching Losses ? Ultra-Low Inductance Package ? 文件：637.48 Kbytes 頁數(shù)：24 Pages | TI 德州儀器 | TI | ||
絲印：87330D；Package：VSON-CLIP(DPB)；CSD87330Q3D Synchronous Buck NexFET? Power Block 1 Features 1? Half-Bridge Power Block ? Up to 27-V VIN ? 90% System Efficiency at 15 A ? Up to 20-A Operation ? High-Frequency Operation (Up to 1.5 MHz) ? High-Density SON 3.3-mm × 3.3-mm Footprint ? Optimized for 5-V Gate Drive ? Low-Switching Losses ? Ultra-Low Inductance Package ? 文件：637.9 Kbytes 頁數(shù)：24 Pages | TI 德州儀器 | TI | ||
絲印：87330D；Package：VSON-CLIP(DPB)；CSD87330Q3D Synchronous Buck NexFET? Power Block 1 Features 1? Half-Bridge Power Block ? Up to 27-V VIN ? 90% System Efficiency at 15 A ? Up to 20-A Operation ? High-Frequency Operation (Up to 1.5 MHz) ? High-Density SON 3.3-mm × 3.3-mm Footprint ? Optimized for 5-V Gate Drive ? Low-Switching Losses ? Ultra-Low Inductance Package ? 文件：637.9 Kbytes 頁數(shù)：24 Pages | TI 德州儀器 | TI | ||
絲?。?a target="_blank" title="Marking" href="/87330d/marking.html">87330D；Package：VSON-CLIP；CSD87330Q3D Synchronous Buck NexFET? Power Block 1 Features 1? Half-Bridge Power Block ? Up to 27-V VIN ? 90% System Efficiency at 15 A ? Up to 20-A Operation ? High-Frequency Operation (Up to 1.5 MHz) ? High-Density SON 3.3-mm × 3.3-mm Footprint ? Optimized for 5-V Gate Drive ? Low-Switching Losses ? Ultra-Low Inductance Package ? 文件：637.48 Kbytes 頁數(shù)：24 Pages | TI 德州儀器 | TI |
技術(shù)參數(shù)
- 本體材質(zhì)：
黃銅
- 本體鍍層：
錫
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
Abbatron/HHSmith |
新 |
5 |
全新原裝 貨期兩周 |
詢價(jià) | |||
Abbatron / HH Smith |
2022+ |
1 |
全新原裝 貨期兩周 |
詢價(jià) | |||
24+ |
5000 |
公司存貨 |
詢價(jià) | ||||
WINBOND |
2016+ |
TQFP100 |
9000 |
只做原裝,假一罰十,公司可開17%增值稅發(fā)票! |
詢價(jià) | ||
WINBOND |
0716+P |
QFP128 |
2312 |
全新原裝 絕對有貨 |
詢價(jià) | ||
HONEYWELL |
13+ |
DIP |
42448 |
原裝分銷 |
詢價(jià) | ||
NS |
24+ |
QFP |
3500 |
原裝現(xiàn)貨,可開13%稅票 |
詢價(jià) | ||
WINBOND |
25+ |
LQFP128 |
432 |
原裝現(xiàn)貨熱賣中,提供一站式真芯服務(wù) |
詢價(jià) | ||
AMIS |
24+ |
QFP100 |
25843 |
公司原廠原裝現(xiàn)貨假一罰十!特價(jià)出售!強(qiáng)勢庫存! |
詢價(jià) | ||
TE |
16+ |
NA |
8800 |
原裝現(xiàn)貨,貨真價(jià)優(yōu) |
詢價(jià) |
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