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          首頁 >2-8>規(guī)格書列表

          型號(hào)下載 訂購功能描述制造商 上傳企業(yè)LOGO

          2-84981-0

          ASSY, 1.00MM FFC CONN SMT, H

          As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

          文件:64.879 Kbytes 頁數(shù):1 Pages

          MACOM

          2-84981-1

          ASSY, 1.00MM FFC CONN SMT, H

          As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

          文件:64.879 Kbytes 頁數(shù):1 Pages

          MACOM

          2-84981-2

          ASSY, 1.00MM FFC CONN SMT, H

          As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

          文件:64.879 Kbytes 頁數(shù):1 Pages

          MACOM

          2-84981-3

          ASSY, 1.00MM FFC CONN SMT, H

          As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

          文件:64.879 Kbytes 頁數(shù):1 Pages

          MACOM

          2-84981-4

          ASSY, 1.00MM FFC CONN SMT, H

          As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

          文件:64.879 Kbytes 頁數(shù):1 Pages

          MACOM

          2-84981-5

          ASSY, 1.00MM FFC CONN SMT, H

          As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

          文件:64.879 Kbytes 頁數(shù):1 Pages

          MACOM

          2-84981-6

          ASSY, 1.00MM FFC CONN SMT, H

          As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

          文件:64.879 Kbytes 頁數(shù):1 Pages

          MACOM

          2-84981-7

          ASSY, 1.00MM FFC CONN SMT, H

          As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

          文件:64.879 Kbytes 頁數(shù):1 Pages

          MACOM

          2-84981-8

          ASSY, 1.00MM FFC CONN SMT, H

          As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

          文件:64.879 Kbytes 頁數(shù):1 Pages

          MACOM

          2-84981-9

          ASSY, 1.00MM FFC CONN SMT, H

          As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

          文件:64.879 Kbytes 頁數(shù):1 Pages

          MACOM

          產(chǎn)品屬性

          • 產(chǎn)品編號(hào):

            2-8

          • 制造商:

            Gedore Tools, Inc.

          • 類別:

            工具 > 扳手

          • 包裝:

            散裝

          • 描述:

            DBL ENDED RING SPANNER OFFSET

          供應(yīng)商型號(hào)品牌批號(hào)封裝庫存備注價(jià)格
          TECONN
          16+
          NA
          8800
          原裝現(xiàn)貨,貨真價(jià)優(yōu)
          詢價(jià)
          TYCO
          24+/25+
          79
          原裝正品現(xiàn)貨庫存價(jià)優(yōu)
          詢價(jià)
          INTERCONNECT
          12500
          TYC
          50000
          詢價(jià)
          TycoElectronicsAmp
          24+
          357
          詢價(jià)
          AMP/TYCO/TE
          2016+
          CONNECTOR
          58500
          只做原裝,假一罰十,公司專營(yíng)進(jìn)口連接器!
          詢價(jià)
          TEConnectivity
          10
          全新原裝 貨期兩周
          詢價(jià)
          AMP
          23+
          NA
          20763
          專做原裝正品,假一罰百!
          詢價(jià)
          AMP
          25+23+
          New
          32966
          絕對(duì)原裝正品現(xiàn)貨,全新深圳原裝進(jìn)口現(xiàn)貨
          詢價(jià)
          TE
          18+
          9800
          代理進(jìn)口原裝/實(shí)單價(jià)格可談
          詢價(jià)
          TECONNE
          25+
          5800
          百分百原裝正品 真實(shí)公司現(xiàn)貨庫存 本公司只做原裝 可
          詢價(jià)
          更多2-8供應(yīng)商 更新時(shí)間2026-1-19 10:04:00
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