SBE? 320 / SBX? 350 Connectors Up to 550 Amps

SBE? and SBX? connectors can integrate up to 8 auxiliary power / signal contacts along with the two primary power circuits. Sequencing within auxiliary positions is possible using the 4 pin lengths available in the 1x4 auxiliary connector. SBE? and SBX? offer touch safe housings. ? Silver Pla

文件：1.16838 Mbytes 頁數(shù)：9 Pages

APP

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 頁數(shù)：2 Pages

MACOM

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 頁數(shù)：2 Pages

MACOM

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 頁數(shù)：2 Pages

MACOM

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 頁數(shù)：2 Pages

MACOM

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 頁數(shù)：2 Pages

MACOM

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 頁數(shù)：2 Pages

MACOM

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 頁數(shù)：2 Pages

MACOM

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 頁數(shù)：2 Pages

MACOM

1.0 mm, FPC Connector, Right Angle, SMT, Bottom Contact

As the demands for higher density packaging of electronic equipment increases, the use of flexible printed circuits (FPC) to reduce size, weight and assembly costs has expanded. FPC is finding wide acceptance in the computer industry, particularly in such applications as Lap Top, Notebook, Palm To

文件：52.6 Kbytes 頁數(shù)：2 Pages

MACOM