Customer Specification

Construction Diameters (In) 1) Component 1 3 X 1 COND a) Conductor 32 (7/40) AWG Tinned Copper 0.009 b) Insulation 0.010 Wall, Nom. PVC 0.029 (1) Color Code Alpha Wire Color Code D Cond Color Cond Color Cond Color 1 BLACK 2 RED 3 WHITE 2) Cable Assembly 3 Components Cabled a) Twists: 36.0

文件：99.13 Kbytes 頁(yè)數(shù)：4 Pages

ALPHAWIRE

Customer Specification

Construction Diameters (In) 1) Component 1 3 X 1 COND a) Conductor 32 (7/40) AWG Tinned Copper 0.009 b) Insulation 0.010 Wall, Nom. PVC 0.029 (1) Color Code Alpha Wire Color Code D Cond Color Cond Color Cond Color 1 BLACK 2 RED 3 WHITE 2) Cable Assembly 3 Components Cabled a) Twists: 36.0

文件：97.93 Kbytes 頁(yè)數(shù)：4 Pages

ALPHAWIRE

PRI TRANSFORMERS Reinforced Insulation

文件：39.15 Kbytes 頁(yè)數(shù)：1 Pages

XFMRS

絲?。?strong>1101；Package：SOD882D；30 V, 0.2 A low VF MEGA Schottky barrier rectifier

1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD882D leadless ultra small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads. 1.2 F

文件：1.3625 Mbytes 頁(yè)數(shù)：14 Pages

NEXPERIA

安世

絲?。?strong>1101；Package：SOIC；SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS

Low rDS(on) . . . 0.09 W Typ at VGS = –10 V 3 V Compatible Requires No External VCC TTL and CMOS Compatible Inputs VGS(th) = –1.5 V Max Available in Ultrathin TSSOP Package (PW) ESD Protection Up to 2 kV per MIL-STD-883C, Method 3015 description The TPS1101 is a single, low-rDS(on), P-c

文件：279.47 Kbytes 頁(yè)數(shù)：15 Pages

TI

德州儀器

絲印：1101；Package：SOIC；SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS

Low rDS(on) . . . 0.09 W Typ at VGS = –10 V 3 V Compatible Requires No External VCC TTL and CMOS Compatible Inputs VGS(th) = –1.5 V Max Available in Ultrathin TSSOP Package (PW) ESD Protection Up to 2 kV per MIL-STD-883C, Method 3015 description The TPS1101 is a single, low-rDS(on), P-c

文件：279.47 Kbytes 頁(yè)數(shù)：15 Pages

TI

德州儀器

絲?。?strong>1101；Package：SOIC；SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS

Low rDS(on) . . . 0.09 W Typ at VGS = –10 V 3 V Compatible Requires No External VCC TTL and CMOS Compatible Inputs VGS(th) = –1.5 V Max Available in Ultrathin TSSOP Package (PW) ESD Protection Up to 2 kV per MIL-STD-883C, Method 3015 description The TPS1101 is a single, low-rDS(on), P-c

文件：279.47 Kbytes 頁(yè)數(shù)：15 Pages

TI

德州儀器

絲印：1101；Package：SOIC；SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS

Low rDS(on) . . . 0.09 W Typ at VGS = –10 V 3 V Compatible Requires No External VCC TTL and CMOS Compatible Inputs VGS(th) = –1.5 V Max Available in Ultrathin TSSOP Package (PW) ESD Protection Up to 2 kV per MIL-STD-883C, Method 3015 description The TPS1101 is a single, low-rDS(on), P-c

文件：279.47 Kbytes 頁(yè)數(shù)：15 Pages

TI

德州儀器

絲?。?strong>1101；Package：SOT-25；ADJUSTABLE LED DRIVER WITH INTERNAL SWITCH IN TSOT23-5

DESCRIPTION The ZXLD1101 is a PFM inductive boost converter designed for driving 2, 3 or 4 series connected white LEDs from a Li-Ion cell and up to 8 LEDs from a 5V supply. The device operates from an input supply of between 2.5V and 5.5V and provides an adjustable output current of up to 50mA.

文件：221.97 Kbytes 頁(yè)數(shù)：16 Pages

ZETEX

包裝：散裝 類別：電池產(chǎn)品 電池座，電池夾，電池觸頭 描述：BATT HLDR 18350 1 CEL SOLDER LUG

Keystone Electronics