絲?。?strong>1101；Package：SOD882D；30 V, 0.2 A low VF MEGA Schottky barrier rectifier

1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD882D leadless ultra small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads. 1.2 F

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絲?。?strong>1101；Package：SOIC；SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS

Low rDS(on) . . . 0.09 W Typ at VGS = –10 V 3 V Compatible Requires No External VCC TTL and CMOS Compatible Inputs VGS(th) = –1.5 V Max Available in Ultrathin TSSOP Package (PW) ESD Protection Up to 2 kV per MIL-STD-883C, Method 3015 description The TPS1101 is a single, low-rDS(on), P-c

文件：279.47 Kbytes 頁數(shù)：15 Pages

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德州儀器

絲?。?strong>1101；Package：SOIC；SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS

Low rDS(on) . . . 0.09 W Typ at VGS = –10 V 3 V Compatible Requires No External VCC TTL and CMOS Compatible Inputs VGS(th) = –1.5 V Max Available in Ultrathin TSSOP Package (PW) ESD Protection Up to 2 kV per MIL-STD-883C, Method 3015 description The TPS1101 is a single, low-rDS(on), P-c

文件：279.47 Kbytes 頁數(shù)：15 Pages

TI

德州儀器

絲?。?strong>1101；Package：SOIC；SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS

Low rDS(on) . . . 0.09 W Typ at VGS = –10 V 3 V Compatible Requires No External VCC TTL and CMOS Compatible Inputs VGS(th) = –1.5 V Max Available in Ultrathin TSSOP Package (PW) ESD Protection Up to 2 kV per MIL-STD-883C, Method 3015 description The TPS1101 is a single, low-rDS(on), P-c

文件：279.47 Kbytes 頁數(shù)：15 Pages

TI

德州儀器

絲?。?strong>1101；Package：SOIC；SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFETS

Low rDS(on) . . . 0.09 W Typ at VGS = –10 V 3 V Compatible Requires No External VCC TTL and CMOS Compatible Inputs VGS(th) = –1.5 V Max Available in Ultrathin TSSOP Package (PW) ESD Protection Up to 2 kV per MIL-STD-883C, Method 3015 description The TPS1101 is a single, low-rDS(on), P-c

文件：279.47 Kbytes 頁數(shù)：15 Pages

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德州儀器

絲?。?strong>1101；Package：SOT-25；ADJUSTABLE LED DRIVER WITH INTERNAL SWITCH IN TSOT23-5

DESCRIPTION The ZXLD1101 is a PFM inductive boost converter designed for driving 2, 3 or 4 series connected white LEDs from a Li-Ion cell and up to 8 LEDs from a 5V supply. The device operates from an input supply of between 2.5V and 5.5V and provides an adjustable output current of up to 50mA.

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絲?。?a target="_blank" title="Marking" href="/110100/marking.html">110100；Package：DFN1010D-3；45 V, 500 mA NPN general-purpose transistors

Features and benefits * General-purpose transistor * Two current gain selections * Low package height of 0.37 mm * AEC-Q101 qualified

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絲?。?a target="_blank" title="Marking" href="/110111/marking.html">110111；Package：SOT1215；50 V, 100 mA PNP resistor-equipped transistors

Features and benefits ? 100 mA output current capability ? built-in bias resistors ? simplifies circuit design ? reduces component count ? reduced pick and place costs ? low package height of 0.37 mm ? AEC-Q101 qualified ? suitable for Automatic Optical Inspection (AOI) of solder joint

文件：2.80866 Mbytes 頁數(shù)：21 Pages

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絲印：110111；Package：DFN1010D-3；50 V, 100 mA PNP resistor-equipped transistors

General description 100 mA PNP Resistor-Equipped Transistor (RET) family in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads. Features and benefits ■ 100 mA output current capability ■ reduced pick and place costs

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絲?。?a target="_blank" title="Marking" href="/110111/marking.html">110111；Package：SOT1215；50 V, 100 mA PNP resistor-equipped transistors

1.1 General description 100 mA PNP Resistor-Equipped Transistor (RET) family in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads. 1.2 Features and benefits 1.3 Applications Table 1. Product overview Type number R1

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