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          首頁 >WLFO>規(guī)格書列表

          型號下載 訂購功能描述制造商 上傳企業(yè)LOGO

          WLFO

          Wafer level packaging applies similar processes as used in front-end wafer processing.

          Design Features Chip-first approach with Known Good Die (KGD) from probed front-end wafers Supports all kinds of incoming wafer diameter and chip packaging media Reconstituted wafer (chip embedding in epoxy) Single die and multi-die solutions, possibility of embedded discrete passives Pa

          文件:1.70714 Mbytes 頁數(shù):5 Pages

          AMKOR

          安靠科技

          供應(yīng)商型號品牌批號封裝庫存備注價格
          Walsin Technology Corporation
          25+
          0603(1608 公制)
          9350
          獨(dú)立分銷商 公司只做原裝 誠心經(jīng)營 免費(fèi)試樣正品保證
          詢價
          24+
          N/A
          57000
          一級代理-主營優(yōu)勢-實(shí)惠價格-不悔選擇
          詢價
          更多WLFO供應(yīng)商 更新時間2026-1-19 16:20:00
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