3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUNICATIONS

文件：1.36065 Mbytes 頁數(shù)：17 Pages

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3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUNICATIONS

文件：1.36065 Mbytes 頁數(shù)：17 Pages

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3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUNICATIONS

文件：1.36065 Mbytes 頁數(shù)：17 Pages

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3 V, SUPER MINIMOLD 900 MHz Si MMIC AMPLIFIER

文件：240.87 Kbytes 頁數(shù)：9 Pages

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3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUMICATIONS

DESCRIPTION\nThe μPC2747TB, μPC2748TB are silicon monolithic integrated circuits designed as amplifier for mobile communications. These ICs are packaged in super minimold package which is smaller than conventional minimold.\nThe μPC2747TB, μPC2748TB have compatible pin connections and performance to ? High-density surface mounting :\n?? 6-pin super minimold package\n? Supply voltage : VCC = 2.7 to 3.3 V\n? Noise figure\n?? : μPC2747TB ; NF = 3.3 dB TYP. @ f = 900 MHz\n?? : μPC2748TB ; NF = 2.8 dB TYP. @ f = 900 MHz\n? Upper limit operating frequency\n?? : μPC2747TB ; fu = 1.8 GHz TYP.\n?? : μPC;

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3 V, 900 MHz Si MMIC AMPLIFIER

DESCRIPTION\nThe UPC2747T is a Silicon Monolithic integrated circuit which is manufactured using the NESAT III process. The NESAT III process produces transistors with fT approaching 20 GHz.\nThis amplifier was designed for 900 MHz receivers in cellular and cordless telephone applications. Operating ? LOW VOLTAGE - LOW CURRENT: 5 mA at 3 V\n? LOW POWER CONSUMPTION: 15 mW TYP\n? SUPER SMALL PACKAGE\n? TAPE AND REEL PACKAGING OPTION AVAILABLE;

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Package：6-TSSOP，SC-88，SOT-363；包裝：卷帶（TR） 類別：RF/IF，射頻/中頻和 RFID 射頻放大器 描述：IC AMP CELL 900MHZ-1.5GHZ SOT363

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包裝：盒 類別：開發(fā)板，套件，編程器 射頻評估和開發(fā)套件，開發(fā)板 描述：EVAL BOARD FOR UPC2747TB

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