采用焊接技術的 50 毫米晶閘管/晶閘管模塊，耐壓 1600 V

用于焊接技術中的50 mm PowerBLOCK 相位控制晶閘管 / 二極管模塊。成本和性能經(jīng)過優(yōu)化可替代眾所周知的高可靠性壓力接觸 技術。 ? 焊料鍵合技術\n? 工業(yè)標準封裝\n? 電氣絕緣銅基板\n\n優(yōu)勢:\n? 利用我們的 IGBT 焊接和接合專業(yè)技術生產(chǎn)\n? 優(yōu)化成本和性能\n? 一個供應各種 PowerBLOCK 模塊的供應商;

Infineon

英飛凌

Solder-Bond Technology

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INFINEON

英飛凌

采用焊接技術的 50 毫米晶閘管/晶閘管模塊，耐壓 1600 V

50 mm Eco Block 1600 V, 320 A thyristor/ thyristor module for phase control in solder bond technology. The cost optimized alternative to the well known highly reliable Power Block modules in pressure contact technology.?\n Now these modules are also available with Thermal Interface Material (T ? Solder-Bond Technology\n? Industrial standard package\n? Electrically insulated copper base plate\n\n優(yōu)勢:\n? Cost effective solution for higher competitiveness\n? Predictably high performance and lifetime due to 100% x-ray monitoring\n? Solid base plate for fast and easy mounting\n? One-stop-sh;

Infineon

英飛凌

Package：模塊；包裝：托盤 類別：分立半導體產(chǎn)品 晶閘管 - SCR - 模塊 描述：THYRISTOR MODULE 1600V 320A

INFINEON

英飛凌

Package：模塊；包裝：散裝 類別：分立半導體產(chǎn)品 晶閘管 - SCR - 模塊 描述：LT-BOND MODULE

INFINEON

英飛凌