ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options ExposedPad configuration for increased thermal efficiency Up to 60% improvement in Theta JA (compared to standard TSSOP or

文件：780.44 Kbytes 頁數(shù)：3 Pages

AMKOR

安靠科技

Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

文件：411.98 Kbytes 頁數(shù)：2 Pages

AMKOR

安靠科技

TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages

FEATURES Cu wire interconnect for lowest cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Available in ExposedPad configuration (Ref: DS571) Green materials are standard – Pb-free and RoHS compliant Stealth dicin

文件：502.24 Kbytes 頁數(shù)：2 Pages

AMKOR

安靠科技

Surface Mount TSSOP Resistor Networks

Absolute tolerances to ±0.1% Tight TC Tracking to ±5ppm/°C Ratio match tolerances to ±0.05% Ultra-stable tantalum nitride resistors Standard Sn/Pb and Pb-free terminations available

文件：562.48 Kbytes 頁數(shù)：4 Pages

TTELEC

絲?。?strong>TSSOP；Package：HCS74Q；SN74HCS74-Q1 Automotive Schmitt-Trigger Input Dual D-Type Positive-Edge-Triggered Flip-Flops With Clear and Preset

文件：1.42704 Mbytes 頁數(shù)：25 Pages

TI

德州儀器

TSSOP Package 14-Pin

(F) TSSOP Package 14-Pin

文件：19.11 Kbytes 頁數(shù)：1 Pages

IRF

Surface mounted, 20 pin package

Package information - TSSOP20 Surface mounted, 20 pin package

文件：122.79 Kbytes 頁數(shù)：3 Pages

ZETEX

Package Outline

Package Outline

文件：114.29 Kbytes 頁數(shù)：1 Pages

GMT

致新科技

Mechanical Dimensions

[BCD SEMI] Mechanical Dimensions

文件：56.21 Kbytes 頁數(shù)：2 Pages

ETCList of Unclassifed Manufacturers

未分類制造商

Package Outline

Package Outline

文件：122.44 Kbytes 頁數(shù)：1 Pages

GMT

致新科技