絲?。?strong>TSSOP；Package：HCS74Q；SN74HCS74-Q1 Automotive Schmitt-Trigger Input Dual D-Type Positive-Edge-Triggered Flip-Flops With Clear and Preset

文件：1.42704 Mbytes 頁數(shù)：25 Pages

TI

德州儀器

絲?。?a target="_blank" title="Marking" href="/tssop-16ep/marking.html">TSSOP-16EP；Package：T16E；LOW NOISE SINGLE PHASE FULL WAVE DIRECT PWM MOTOR DRIVER

Features ? Single-Phase Full Wave BLDC Fan/Motor Drive with BTL Output (BTL Amplifier Gain = 49dB) ? Low Noise Architecture ? Wide Operating Voltage Range: 2.4V to 18V ? PWM Speed Control with External PWM Input ? DC Voltage Speed Control by Adjusting VCONT and RMI Voltage ? Hall Bias Outp

文件：977.25 Kbytes 頁數(shù)：16 Pages

DIODES

美臺半導體

絲?。?a target="_blank" title="Marking" href="/tssop8/marking.html">TSSOP8；Low Power Dual Voltage Comparators

Description These devices consist of two independent low voltage comparators designed specifically to operate from a single supply over a wide range of voltages. Operation from split power supplies is also possible. These comparators also have a unique characteristic in that the input common-mod

文件：264.64 Kbytes 頁數(shù)：15 Pages

STMICROELECTRONICS

意法半導體

絲印：TSSOP8；Low Power Dual Voltage Comparators

Description These devices consist of two independent low voltage comparators designed specifically to operate from a single supply over a wide range of voltages. Operation from split power supplies is also possible. These comparators also have a unique characteristic in that the input common-mod

文件：264.64 Kbytes 頁數(shù)：15 Pages

STMICROELECTRONICS

意法半導體

絲?。?a target="_blank" title="Marking" href="/tssop14/marking.html">TSSOP14；Package：B714AI；Precision rail-to-rail input / output 36 V, 6 MHz op-amps

文件：3.30826 Mbytes 頁數(shù)：36 Pages

STMICROELECTRONICS

意法半導體

絲?。?a target="_blank" title="Marking" href="/tssop14/marking.html">TSSOP14；Package：B714AY；Precision rail-to-rail input / output 36 V, 6 MHz op-amps

文件：3.30826 Mbytes 頁數(shù)：36 Pages

STMICROELECTRONICS

意法半導體

絲印：TSSOP14；Package：B714I；Precision rail-to-rail input / output 36 V, 6 MHz op-amps

文件：3.30826 Mbytes 頁數(shù)：36 Pages

STMICROELECTRONICS

意法半導體

絲?。?a target="_blank" title="Marking" href="/tssop14/marking.html">TSSOP14；Package：B714IY；Precision rail-to-rail input / output 36 V, 6 MHz op-amps

文件：3.30826 Mbytes 頁數(shù)：36 Pages

STMICROELECTRONICS

意法半導體

ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options ExposedPad configuration for increased thermal efficiency Up to 60% improvement in Theta JA (compared to standard TSSOP or

文件：780.44 Kbytes 頁數(shù)：3 Pages

AMKOR

安靠科技

Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

文件：411.98 Kbytes 頁數(shù)：2 Pages

AMKOR

安靠科技