MICROWAVE POWER GaAs FET

FEATURES ?BROAD BAND INTERNALLY MATCHED FET ?HIGH POWER P1dB= 45.0dBm at 5.9GHz to 6.4GHz ?HIGH GAIN G1dB= 10.0dB at 5.9GHz to 6.4GHz ?LOW INTERMODULATION DISTORTION IM3(MIN.) = -44dBc at Pout= 34dBm (Single Carrier Level) ?HERMETICALLY SEALED PACKAGE

文件：334.11 Kbytes 頁數(shù)：8 Pages

TOSHIBA

東芝

MICROWAVE POWER GaAs FET

FEATURES ?BROAD BAND INTERNALLY MATCHED FET ?HIGH POWER P1dB= 36.5dBm at 5.85GHz to 6.75GHz ?HIGH GAIN G1dB= 8.0dB(Min.) at 5.85GHz to 6.75GHz ?HERMETICALLY SEALED PACKAGE ?LOW INTERMODULATION DISTORTION IM3= -45dBc at Pout= 25.5dBm Single Carrier Level.

文件：388.56 Kbytes 頁數(shù)：4 Pages

TOSHIBA

東芝

MICROWAVE POWER GaAs FET

FEATURES ?BROAD BAND INTERNALLY MATCHED FET ?HIGH POWER P1dB= 48.0dBm at 5.85GHz to 6.75GHz ?HIGH GAIN G1dB= 8.0dB at 5.85GHz to 6.75GHz ?LOW INTERMODULATION DISTORTION IM3= -45dBc at Pout= 36.5dBm (Single Carrier Level) ?HERMETICALLY SEALED PACKAGE

文件：308.87 Kbytes 頁數(shù)：7 Pages

TOSHIBA

東芝

MICROWAVE POWER GaAs FET

FEATURES ?BROAD BAND INTERNALLY MATCHED FET ?HIGH POWER P1dB= 45.0dBm at 6.4GHz to 7.2GHz ?HIGH GAIN G1dB= 9.5dB at 6.4GHz to 7.2GHz ?LOW INTERMODULATION DISTORTION IM3(MIN)= -44dBc at Pout= 34dBm (Single Carrier Level) ?HERMETICALLY SEALED PACKAGE

文件：310.56 Kbytes 頁數(shù)：6 Pages

TOSHIBA

東芝

MICROWAVE POWER GaAs FET

FEATURES ?BROAD BAND INTERNALLY MATCHED FET ?HIGH POWER P1dB= 48.0dBm at 6.4GHz to 7.2GHz ?HIGH GAIN G1dB= 7.5dB at 6.4GHz to 7.2GHz ?LOW INTERMODULATION DISTORTION IM3(MIN.) = -42dBc at Pout= 36.5dBm (Single Carrier Level) ?HERMETICALLY SEALED PACKAGE

文件：328.46 Kbytes 頁數(shù)：6 Pages

TOSHIBA

東芝

MICROWAVE POWER GaAs FET

FEATURES ?BROAD BAND INTERNALLY MATCHED FET ?HIGH POWER P1dB= 45.0dBm at 7.1GHz to 7.9GHz ?HIGH GAIN G1dB= 8.5dB at 7.1GHz to 7.9GHz ?LOW INTERMODULATION DISTORTION IM3(MIN.) = -44dBc at Pout= 34dBm (Single Carrier Level) ?HERMETICALLY SEALED PACKAGE

文件：312.71 Kbytes 頁數(shù)：7 Pages

TOSHIBA

東芝

MICROWAVE POWER GaAs FET

FEATURES ?BROAD BAND INTERNALLY MATCHED FET ?HIGH POWER P1dB= 48.0dBm at 7.7GHz to 8.5GHz ?HIGH GAIN G1dB= 7.5dB at 7.7GHz to 8.5GHz ?LOW INTERMODULATION DISTORTION IM3(MIN.)= -25dBc at Pout= 41dBm (Single Carrier Level) ?HERMETICALLY SEALED PACKAGE

文件：307.67 Kbytes 頁數(shù)：6 Pages

TOSHIBA

東芝

2D LIDAR SENSORS

Features Measurement principle HDDM+ Application Outdoor Light source Infrared (850 nm) Laser class 1 (IEC 60825-1:2014, EN 60825-1:2014) Aperture angle Horizontal 270° Scanning frequency 15 Hz Angular resolution 0.33° Working range 0.05 m ... 25 m Scanning range At 10 remission 8 m

文件：597.54 Kbytes 頁數(shù)：9 Pages

SICK

西克

SCALE-2 Plug-and-Play Drivers

Features ? Plug-and-play solution ? Allows parallel connection of IGBT modules ? For 2-level, 3-level and multilevel topologies ? Built-in isolated DC/DC power supply (master) ? Fiber-optic links (master) ? Built-in interface to 1SP0635D2S1(C) (slave) ? Duty cycle 0...100 ? Dynamic Advance

文件：190.02 Kbytes 頁數(shù)：9 Pages

POWERINTPower Integrations, Inc.

荷蘭帕沃英蒂格盛有限公司

8-LINE TO 3-LINE PRIORITY ENCODERS WITH 3-STATE OUTPUTS

3-State Outputs Drive Bus Lines Directly Encodes 8 Data Lines to 3-Line Binary (Octal) Applications Include: N-Bit Encoding Code Converters and Generators Typical Data Delay... 15 ns Typical Power Dissipation . . . 60 mW description These TTL encoders feature priority decoding of the in

文件：420.81 Kbytes 頁數(shù)：9 Pages

TI

德州儀器