0.4mm Pitch, 0.65mm Height, Back-Flip Type, 1Row, Bottom Contact, FPC To Board CONNECTOR

文件：465.15 Kbytes 頁數(shù)：6 Pages

HIROSEHirose Electric Company

廣瀨日本廣瀨電機(jī)株式會社

絲?。?a target="_blank" title="Marking" href="/tf110p03m/marking.html">TF110P03M；Package：PDFNWB3.3x3.3-8L；P -CHANNEL ENHANCEMENT MODE POWER MOSFET

● General Description The TF110P03M combines advanced trench MOSFETtechnology with a low resistance package toprovideextremely low RDS(ON). ● Features Advance high cell density Trench technology Low RDS(ON) to minimize conductive loss Low Gate Charge for fast switching Low Thermal resistan

文件：2.62205 Mbytes 頁數(shù)：5 Pages

TUOFENG

拓鋒半導(dǎo)體

絲印：TF110P03N；Package：TF110P03NAYXXA；P -CHANNEL ENHANCEMENT MODE POWER MOSFET

● General Description The TF110P03N combines advanced trench MOSFETtechnology with a low resistance package toprovideextremely low RDS(ON). ● Features Advance high cell density Trench technology Low RDS(ON) to minimize conductive loss Low Gate Charge for fast switching Low Thermal resistan

文件：2.83123 Mbytes 頁數(shù)：5 Pages

TUOFENG

拓鋒半導(dǎo)體

SOLID STATE I/O INTERFACE MODULE (DC INPUT MODULE)

文件：134.55 Kbytes 頁數(shù)：2 Pages

TOSHIBA

東芝

SOLID STATE I/O INTERFACE MODULE (DC INPUT MODULE)

文件：134.04 Kbytes 頁數(shù)：2 Pages

TOSHIBA

東芝

SOLID STATE I/O INTERFACE MODULE (DC INPUT MODULE)

文件：164.19 Kbytes 頁數(shù)：3 Pages

TOSHIBA

東芝

SOLID STATE I/O INTERFACE MODULE (DC INPUT MODULE)

文件：151.31 Kbytes 頁數(shù)：3 Pages

TOSHIBA

東芝

0.4mm Pitch, 0.65mm Height, Back-Flip Type, 1Row, Bottom Contact, FPC To Board CONNECTOR

文件：465.15 Kbytes 頁數(shù)：6 Pages

HIROSEHirose Electric Company

廣瀨日本廣瀨電機(jī)株式會社

Overture TM Audio Power Amplifier Series High-Performance 68W Audio Power Amplifier w/Mute

文件：846.44 Kbytes 頁數(shù)：24 Pages

NSC

國半

Temperature probe according to DIN with thermowell

? Standard process adaptationwith G1/2” threaded connection\n? interchangeable terminal head\n? optional: calibrationcertificate with tracing evidence according to DIN ISO 9000 ff;

SELI

賽力康電氣