Class-AB stereo headphone driver

General description The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump wafer level chip-size package (WLCSP8). The device is fabricated in a 1μm Complementary Metal Oxide Semicondu

文件：117.77 Kbytes 頁數(shù)：19 Pages

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Class-AB stereo headphone driver

General description The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump wafer level chip-size package (WLCSP8). The device is fabricated in a 1μm Complementary Metal Oxide Semicondu

文件：117.77 Kbytes 頁數(shù)：19 Pages

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Class AB stereo headphone driver

GENERAL DESCRIPTION The TDA1308; TDA1308A is an integrated class AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications. FEATURES ? Wide tempe

文件：95.75 Kbytes 頁數(shù)：16 Pages

PHI

PHI

Class AB stereo headphone driver

GENERAL DESCRIPTION The TDA1308; TDA1308A is an integrated class AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications. FEATURES ? Wide tempe

文件：197.87 Kbytes 頁數(shù)：12 Pages

PHI

PHI

Class AB stereo headphone driver

GENERAL DESCRIPTION The TDA1308; TDA1308A is an integrated class AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications. FEATURES ? Wide tempe

文件：95.75 Kbytes 頁數(shù)：16 Pages

PHI

PHI

Class-AB stereo headphone driver

General description The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump wafer level chip-size package (WLCSP8). The device is fabricated in a 1μm Complementary Metal Oxide Semicondu

文件：117.77 Kbytes 頁數(shù)：19 Pages

恩XP

Class-AB stereo headphone driver

文件：584.89 Kbytes 頁數(shù)：17 Pages

PHI

PHI

Class-AB stereo headphone driver

Overview The TDA1308 is an integrated class-AB stereo headphone driver contained in an SO8 or a TSSOP8 plastic package. The device is fabricated in a 1 μm Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily developed for portable digital audio applications. Wide temperature range\nNo switch ON/OFF clicks\nExcellent power supply ripple rejection\nLow power consumption\nShort-circuit resistant\nHigh performance High signal-to-noise ratio\nHigh slew rate\nLow distortion\n\nLarge output voltage swing;

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