Back END IC

GENERAL DESCRIPTION Application Environment The Back END IC (abbreviated as BENDIC) is designed to cooperate with an 8051 type of microprocessor, the ECO3 (SAA4951) memory controller and Texas Instruments TMS4C2970 memories, but other configurations may be applicable. Fig.1 shows the block d

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PHI

PHI

Back END IC

GENERAL DESCRIPTION\nApplication Environment\nThe Back END IC (abbreviated as BENDIC) is designed to cooperate with an 8051 type of microprocessor, the ECO3 (SAA4951) memory controller and Texas Instruments TMS4C2970 memories, but other configurations may be applicable. Fig.1 shows the block diagram ? Line Flicker Reduction (LFR) by means of MEDIAN filtering\n? Vertical zoom\n? Digital colour transient improvement\n? Digital luminance peaking\n? Movie phase detection\n? 4:4:4 YUV data throughput selectable, standard is 4:1:1 Y/U/V\n? D/A conversion\n? UART interface.;

恩XP

Back END IC

GENERAL DESCRIPTION Application Environment The Back END IC (abbreviated as BENDIC) is designed to cooperate with an 8051 type of microprocessor, the ECO3 (SAA4951) memory controller and Texas Instruments TMS4C2970 memories, but other configurations may be applicable. Fig.1 shows the block d

文件：117.15 Kbytes 頁(yè)數(shù)：18 Pages

PHI

PHI

Compression plate distributes forces evenly

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IRONWOOD

Enhanced 18-PHY 1.5Gbps and 3.0Gbps SAS Edge/Fanout Expander

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MAXIM

美信