絲?。?strong>S12A；Package：TSSOP-8；EEPROM Serial 512-Kb SPI

文件：395.61 Kbytes 頁數(shù)：20 Pages

ONSEMI

安森美半導(dǎo)體

絲印：S12A；Package：TSSOP-8；EEPROM Serial 512-Kb SPI

文件：395.61 Kbytes 頁數(shù)：20 Pages

ONSEMI

安森美半導(dǎo)體

絲?。?a target="_blank" title="Marking" href="/s12a45s/marking.html">S12A45S；Package：POWERDI5；12A SBR? SUPER BARRIER RECTIFIER POWERDI?

Features Designed as Bypass Diodes for Solar Panels Selectively Rated for +200°C Maximum Junction Temperature for High Thermal Reliability Patented Super Barrier Rectifier Technology Low Forward Voltage Drop Excellent High Temperature Stability Lead Free Finish, RoHS Compliant (Notes 1 & 2)

文件：561.87 Kbytes 頁數(shù)：5 Pages

DIODES

美臺半導(dǎo)體

COMMERCIAL PHONE JACKS

1/4 PHONE JACKS

文件：152.43 Kbytes 頁數(shù)：8 Pages

SWITCH

Device User Guide V01.18

Overview The MC9S12H256 microcontroller unit (MCU) is a 16-bit device composed of standard on-chip peripherals including a 16-bit central processing unit (HCS12 CPU), 256K bytes of Flash EEPROM, 12K bytes of RAM, 4K bytes of EEPROM, two asynchronous serial communications interfaces (SCI), a

文件：5.66869 Mbytes 頁數(shù)：130 Pages

FREESCALEFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

Device User Guide V01.18

Overview The MC9S12H256 microcontroller unit (MCU) is a 16-bit device composed of standard on-chip peripherals including a 16-bit central processing unit (HCS12 CPU), 256K bytes of Flash EEPROM, 12K bytes of RAM, 4K bytes of EEPROM, two asynchronous serial communications interfaces (SCI), a

文件：5.66869 Mbytes 頁數(shù)：130 Pages

FREESCALEFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

The SoC Guide provides information about the MC9S12KG128 device made up of standard HCS12 blocks and the HCS12 processor core

Features HCS12 Core – 16-bit HCS12 CPU i. Upward compatible with M68HC11 instruction set ii. Interrupt stacking and programmer’s model identical to M68HC11 iii. Instruction queue iv. Enhanced indexed addressing System Integration Module (SIM) – MEBI (Multiplexed External Bus Interface) –

文件：1.03548 Mbytes 頁數(shù)：98 Pages

恩XP

The SoC Guide provides information about the MC9S12KG128 device made up of standard HCS12 blocks and the HCS12 processor core

Features HCS12 Core – 16-bit HCS12 CPU i. Upward compatible with M68HC11 instruction set ii. Interrupt stacking and programmer’s model identical to M68HC11 iii. Instruction queue iv. Enhanced indexed addressing System Integration Module (SIM) – MEBI (Multiplexed External Bus Interface) –

文件：1.03548 Mbytes 頁數(shù)：98 Pages

恩XP

MC9S12XDP512 Device User Guide

Features HCS12X Core – 16-bit HCS12X CPU i. Upward compatible with MC9S12 instruction set ii. Interrupt stacking and programmer’s model identical to MC9S12 iii. Instruction queue iv. Enhanced indexed addressing v. Enhanced instruction set – EBI (External Bus Interface) – MMC (Module Mappi

文件：1.59943 Mbytes 頁數(shù)：152 Pages

恩XP

MC9S12XDP512 Device User Guide

Features HCS12X Core – 16-bit HCS12X CPU i. Upward compatible with MC9S12 instruction set ii. Interrupt stacking and programmer’s model identical to MC9S12 iii. Instruction queue iv. Enhanced indexed addressing v. Enhanced instruction set – EBI (External Bus Interface) – MMC (Module Mappi

文件：2.00523 Mbytes 頁數(shù)：176 Pages

恩XP