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          首頁(yè) >RTH>規(guī)格書(shū)列表

          型號(hào)下載 訂購(gòu)功能描述制造商 上傳企業(yè)LOGO

          RTH221-8270J

          Positive - Temperature - Coefficient Silicon Thermistors

          SENSISTORS Positive - Temperature - Coefficient Silicon Thermistors DESCRIPTION The TG1/8 thermistor is encapsulated in a glass, hermetically sealed package. The TM1/8 and TM1/4 thermistors are encapsulated in a molded package. Both have hot solder0dipped leads and are used in temperature sensi

          文件:201.27 Kbytes 頁(yè)數(shù):4 Pages

          MICROSEMI

          美高森美

          RTH221-8270K

          Positive - Temperature - Coefficient Silicon Thermistors

          SENSISTORS Positive - Temperature - Coefficient Silicon Thermistors DESCRIPTION The TG1/8 thermistor is encapsulated in a glass, hermetically sealed package. The TM1/8 and TM1/4 thermistors are encapsulated in a molded package. Both have hot solder0dipped leads and are used in temperature sensi

          文件:201.27 Kbytes 頁(yè)數(shù):4 Pages

          MICROSEMI

          美高森美

          RTH221-8271J

          Positive - Temperature - Coefficient Silicon Thermistors

          SENSISTORS Positive - Temperature - Coefficient Silicon Thermistors DESCRIPTION The TG1/8 thermistor is encapsulated in a glass, hermetically sealed package. The TM1/8 and TM1/4 thermistors are encapsulated in a molded package. Both have hot solder0dipped leads and are used in temperature sensi

          文件:201.27 Kbytes 頁(yè)數(shù):4 Pages

          MICROSEMI

          美高森美

          RTH221-8271K

          Positive - Temperature - Coefficient Silicon Thermistors

          SENSISTORS Positive - Temperature - Coefficient Silicon Thermistors DESCRIPTION The TG1/8 thermistor is encapsulated in a glass, hermetically sealed package. The TM1/8 and TM1/4 thermistors are encapsulated in a molded package. Both have hot solder0dipped leads and are used in temperature sensi

          文件:201.27 Kbytes 頁(yè)數(shù):4 Pages

          MICROSEMI

          美高森美

          RTH221-8272J

          Positive - Temperature - Coefficient Silicon Thermistors

          SENSISTORS Positive - Temperature - Coefficient Silicon Thermistors DESCRIPTION The TG1/8 thermistor is encapsulated in a glass, hermetically sealed package. The TM1/8 and TM1/4 thermistors are encapsulated in a molded package. Both have hot solder0dipped leads and are used in temperature sensi

          文件:201.27 Kbytes 頁(yè)數(shù):4 Pages

          MICROSEMI

          美高森美

          RTH221-8272K

          Positive - Temperature - Coefficient Silicon Thermistors

          SENSISTORS Positive - Temperature - Coefficient Silicon Thermistors DESCRIPTION The TG1/8 thermistor is encapsulated in a glass, hermetically sealed package. The TM1/8 and TM1/4 thermistors are encapsulated in a molded package. Both have hot solder0dipped leads and are used in temperature sensi

          文件:201.27 Kbytes 頁(yè)數(shù):4 Pages

          MICROSEMI

          美高森美

          RTH221-8273J

          Positive - Temperature - Coefficient Silicon Thermistors

          SENSISTORS Positive - Temperature - Coefficient Silicon Thermistors DESCRIPTION The TG1/8 thermistor is encapsulated in a glass, hermetically sealed package. The TM1/8 and TM1/4 thermistors are encapsulated in a molded package. Both have hot solder0dipped leads and are used in temperature sensi

          文件:201.27 Kbytes 頁(yè)數(shù):4 Pages

          MICROSEMI

          美高森美

          RTH221-8273K

          Positive - Temperature - Coefficient Silicon Thermistors

          SENSISTORS Positive - Temperature - Coefficient Silicon Thermistors DESCRIPTION The TG1/8 thermistor is encapsulated in a glass, hermetically sealed package. The TM1/8 and TM1/4 thermistors are encapsulated in a molded package. Both have hot solder0dipped leads and are used in temperature sensi

          文件:201.27 Kbytes 頁(yè)數(shù):4 Pages

          MICROSEMI

          美高森美

          RTH22ES682J

          POSITIVE TEMPERATURE COEFFICIENT SILICON THERMISTORS

          DESCRIPTION The TG1/8 thermistor is encapsulated in a glass, hermetically sealed package. The TM1/8 and TM1/4 thermistors are encapsulated in a molded package. Both have hot solder-dipped leads and are used in temperature sensing and compensation circuits.

          文件:189.52 Kbytes 頁(yè)數(shù):4 Pages

          MICROSEMI

          美高森美

          RTH23007-10

          GaN Doherty Hybrid Amplifier

          Description Accommodating the future of 4G/LTE small cells, RFHIC introduces RTH23007-10 amplifier fabricated using an advanced high power density Gallium Nitride (GaN) semiconductor process. This high performance amplifier achieves high efficiency of 45, and powers 7W over the frequency range

          文件:295.24 Kbytes 頁(yè)數(shù):7 Pages

          RFHIC

          技術(shù)參數(shù)

          • 阻值(Ω):

            0R1~1M

          • 精度:

            ±0.5%~±10%

          • TCR(PPM/°C):

            ±50~±250

          • 產(chǎn)品特點(diǎn):

            高精度,大功率,無(wú)感設(shè)計(jì),高穩(wěn)定,溫度范圍-40℃~130℃

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          更多RTH供應(yīng)商 更新時(shí)間2026-1-19 15:30:00
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