PACKAGED FLIP CHIP ARRAY

DESCRIPTION The PKFCxxC series encapsulated flip chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, thi

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PACKAGED FLIP CHIP ARRAY

[Protek-Devices] FEATURES ? CHIP SCALE PACKAGE 0.050” (1.270mm) x 0.030” (0.762mm) ? ESD Protection > 25 kilovolts ? Available in Multiple Voltage Types Ranging From 3.3V to 36V ? 250 Watts Peak Pulse Power per Line (tp = 8/20μs) ? Bidirectional Configuration & Monolithic Structure ? Pr

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PACKAGED FLIP CHIP ARRAY

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250w encapsulated flip chip tvs array

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250W ENCAPSULATED FLIP CHIP TVS ARRAY

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Packaged Flip Chip TVS Array

? IEC 61000-4-2 (ESD): Air - 15kV, Contact - 8kV\n? IEC 61000-4-4 (EFT): 40A - 5/50ns\n? Chip Scale Package 0.050” (1.270mm) x 0.030” (0.762mm)\n? ESD Protection > 25 kilovolts\n? Available in Voltages Ranging From 3.3V to 36V\n? 250 Watts Peak Pulse Power per Line (tp = 8/20μs)\n? Bidirectional Con;

Protek Devices