PACKAGED FLIP CHIP ARRAY

DESCRIPTION The PKFCxxC series encapsulated flip chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, thi

文件：72.73 Kbytes 頁(yè)數(shù)：5 Pages

PROTEC

PACKAGED FLIP CHIP ARRAY

[Protek-Devices] FEATURES ? CHIP SCALE PACKAGE 0.050” (1.270mm) x 0.030” (0.762mm) ? ESD Protection > 25 kilovolts ? Available in Multiple Voltage Types Ranging From 3.3V to 36V ? 250 Watts Peak Pulse Power per Line (tp = 8/20μs) ? Bidirectional Configuration & Monolithic Structure ? Pr

文件：98.46 Kbytes 頁(yè)數(shù)：5 Pages

ETCList of Unclassifed Manufacturers

未分類制造商

PACKAGED FLIP CHIP ARRAY

文件：82.57 Kbytes 頁(yè)數(shù)：5 Pages

PROTEC

250w encapsulated flip chip tvs array

文件：473.5 Kbytes 頁(yè)數(shù)：7 Pages

PROTEC

250W ENCAPSULATED FLIP CHIP TVS ARRAY

文件：475.07 Kbytes 頁(yè)數(shù)：7 Pages

PROTEC

Packaged Flip Chip TVS Array

? IEC 61000-4-2 (ESD): Air - 15kV, Contact - 8kV\n? IEC 61000-4-4 (EFT): 40A - 5/50ns\n? Chip Scale Package 0.050” (1.270mm) x 0.030” (0.762mm)\n? ESD Protection > 25 kilovolts\n? Available in Voltages Ranging From 3.3V to 36V\n? 250 Watts Peak Pulse Power per Line (tp = 8/20μs)\n? Bidirectional Con;

Protek Devices