ExpressLane??PCI Express to PCI Bridge

ExpressLane? PCI Express to PCI Bridge Features ? General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

文件：112.23 Kbytes 頁數(shù)：2 Pages

PLX

ExpressLane??PCI Express to PCI Bridge

文件：183.32 Kbytes 頁數(shù)：2 Pages

BOARDCOM

博通

PCIe Bridges : PEX 8112

The ExpressLane? PEX 8112 is a high performance bridge designed to the PCI Express-to-PCI Bridge Specification 1.0, that enables designers to migrate legacy PCI bus interfaces to the new advanced serial PCI Express. This 2-port device is equipped with a single lane PCI Express port and a parallel bu

Broadcom

博通

ExpressLane??PCI Express to PCI Bridge

ExpressLane? PCI Express to PCI Bridge Features ? General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

文件：112.23 Kbytes 頁數(shù)：2 Pages

PLX

ExpressLane??PCI Express to PCI Bridge

ExpressLane? PCI Express to PCI Bridge Features ? General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

文件：112.23 Kbytes 頁數(shù)：2 Pages

PLX

ExpressLane??PCI Express to PCI Bridge

ExpressLane? PCI Express to PCI Bridge Features ? General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

文件：112.23 Kbytes 頁數(shù)：2 Pages

PLX

ExpressLane??PCI Express to PCI Bridge

ExpressLane? PCI Express to PCI Bridge Features ? General Features o Forward and Reverse bridging o 144-ball BGA package with standard 1.0 mm pitch (13mm x 13mm) o 161-ball BGA package with fine 0.65 mm pitch (10mm x 10mm) o Low power – 400 milliwatts o EEPROM configuration

文件：112.23 Kbytes 頁數(shù)：2 Pages

PLX

Package：144-BGA；包裝：卷帶（TR）剪切帶（CT）Digi-Reel? 得捷定制卷帶 類別：集成電路（IC） 專用 描述：IC INTERFACE SPECIALIZED 144BGA

BOARDCOM

博通