ST STM32MP15x, DDR3L, STPMIC1A,4KB EEPROM, Oscillator and passive components integrated into a single package

Features ? ST STM32MP15x, DDR3L, STPMIC1A, 4KB EEPROM, Oscillator and passive components integrated into a single package ? STM32MP15x Features: o Arm? Cortex?-A7 up to 800MHz x2 o Arm? Cortex?-M4 up to 209MHz o NEON?SIMD Coprocessor x2 o Arm? TrustZone? o USB 2.0 HS + PHY x2 o Ethernet 10

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System-in-Package Fully Integrated STM32MP1 System the Same Size as the Processor

The OSD32MP15x module is the first System in Package based on the STMicroelectronics STM32MP1. Delivering all the power of a full Microprocessor system in a package that feels like a Microcontroller, the OSD32MP15x has a footprint that is the same size as the ST32MP1 itself. The SiP integrates the

Octavo

System-in-Package Fully Integrated STM32MP1 System the Same Size as the Processor

System-In-Package -\r\nST32MP157F, 512MB x16 DDR3L, 4KB EEPROM,\r\n24MHz MEMS Oscillator,\r\nSTPMIC1A, Passives -\r\n18mm X 18mm, 302 Ball BGA, -20°C to 85°C

Octavo

包裝：散裝 類別：集成電路（IC） 微控制器，微處理器，F(xiàn)PGA 模塊 描述：SIP: 157F, 512MB, BAA

Octavo Systems LLC

包裝：散裝 類別：集成電路（IC） 微控制器，微處理器，F(xiàn)PGA 模塊 描述：SYSTEM IN A PACKAGE ( SIP)

Octavo Systems LLC