Rev2.1 CSM PBFREE 1333 LOW PWR EXT TEMP

恩XP’s next-generation PowerQUICC? III integrated communications processors are designed to provide solutions for symmetrical and asymmetrical multi-core systems. Based on the scalable e500 processor and system-on-chip (SoC) platform, they deliver dual-core gigahertz plus processing performance with ? Dual e500 Power Architecture cores scaling to 1.5 GHz\n? 1 MB L2 cache/SRAM with I/O stashing\n? 32 KB I/D L1 cache per core\n? Dual integrated DDR2/DDR3 SDRAM memory controllers ? 64-bits (72-bits with ECC) per controller\n? to 800 MHz datarate\n? Four integrated Ethernet controllers (enhanced TS;

恩XP

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications

文件：1.41236 Mbytes 頁數(shù)：140 Pages

FREESCALEFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導體

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications

文件：1.41236 Mbytes 頁數(shù)：140 Pages

FREESCALEFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導體

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications

文件：1.41236 Mbytes 頁數(shù)：140 Pages

FREESCALEFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導體

MPC8572E PowerQUICC III Integrated Processor Hardware Specifications

文件：1.41236 Mbytes 頁數(shù)：140 Pages

FREESCALEFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導體