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          首頁 >MPC8360>規(guī)格書列表

          型號(hào)下載 訂購功能描述制造商 上傳企業(yè)LOGO

          MPC8360ECZUAJFHA

          PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

          This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

          文件:1.20024 Mbytes 頁數(shù):102 Pages

          恩XP

          恩XP

          MPC8360ECZUALDGA

          PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

          This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

          文件:1.20024 Mbytes 頁數(shù):102 Pages

          恩XP

          恩XP

          MPC8360ECZUALDHA

          PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

          This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

          文件:1.20024 Mbytes 頁數(shù):102 Pages

          恩XP

          恩XP

          MPC8360ECZUALFGA

          PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

          This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

          文件:1.20024 Mbytes 頁數(shù):102 Pages

          恩XP

          恩XP

          MPC8360ECZUALFHA

          PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

          This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

          文件:1.20024 Mbytes 頁數(shù):102 Pages

          恩XP

          恩XP

          MPC8360EEC

          PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

          This document provides an overview of the MPC8360E/58E PowerQUICC II Pro processor revision 2.x TBGA features, including a block diagram showing the major functional components. This device is a cost-effective, highly integrated communications processor that addresses the needs of the networki

          文件:1.20024 Mbytes 頁數(shù):102 Pages

          恩XP

          恩XP

          MPC8360CVVAGDGA

          PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

          文件:612.19 Kbytes 頁數(shù):102 Pages

          FREESCALEFreescale Semiconductor, Inc

          飛思卡爾飛思卡爾半導(dǎo)體

          MPC8360CVVAGDHA

          PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

          文件:612.19 Kbytes 頁數(shù):102 Pages

          FREESCALEFreescale Semiconductor, Inc

          飛思卡爾飛思卡爾半導(dǎo)體

          MPC8360CVVAGFGA

          PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

          文件:612.19 Kbytes 頁數(shù):102 Pages

          FREESCALEFreescale Semiconductor, Inc

          飛思卡爾飛思卡爾半導(dǎo)體

          MPC8360CVVAGFHA

          PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications

          文件:612.19 Kbytes 頁數(shù):102 Pages

          FREESCALEFreescale Semiconductor, Inc

          飛思卡爾飛思卡爾半導(dǎo)體

          技術(shù)參數(shù)

          • 核數(shù)/總線寬度:

            1 ??,32 位

          • 速度:

            266MHz

          • 協(xié)處理器/DSP:

            通信;QUICC 引擎

          • RAM 控制器:

            DDR,DDR2

          • 圖形加速:

          • 以太網(wǎng):

            10/100/1000 Mbps(1)

          • USB:

            USB 1.x (1)

          • 電壓 - I/O:

            1.8V,2.5V,3.3V

          • 工作溫度:

            -40°C ~ 105°C(TA)

          • 封裝/外殼:

            740-LBGA

          • 供應(yīng)商器件封裝:

            740-TBGA(37.5x37.5)

          • 附加接口:

            DUART,HDLC,I2C,PCI,SPI,UART

          供應(yīng)商型號(hào)品牌批號(hào)封裝庫存備注價(jià)格
          FREESCAL
          25+
          BGA
          3386
          品牌專業(yè)分銷商,可以零售
          詢價(jià)
          FREESCA
          25+
          TBGA740
          8
          百分百原裝正品 真實(shí)公司現(xiàn)貨庫存 本公司只做原裝 可
          詢價(jià)
          FREESCLE
          24+
          50
          詢價(jià)
          MOTOROLA
          24+
          BGA
          6980
          原裝現(xiàn)貨,可開13%稅票
          詢價(jià)
          FSL
          24+
          7860
          原裝現(xiàn)貨假一罰十
          詢價(jià)
          FREESCALE
          17+
          BGA
          6200
          100%原裝正品現(xiàn)貨
          詢價(jià)
          原廠
          23+
          BGA
          5000
          原裝正品,假一罰十
          詢價(jià)
          Freescale
          16+
          BGA
          8800
          進(jìn)口原裝大量現(xiàn)貨熱賣中
          詢價(jià)
          FREESCAL
          BGA
          254
          正品原裝--自家現(xiàn)貨-實(shí)單可談
          詢價(jià)
          FREESCAL
          24+
          BGA
          5000
          全現(xiàn)原裝公司現(xiàn)貨
          詢價(jià)
          更多MPC8360供應(yīng)商 更新時(shí)間2026-1-19 11:02:00
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