Hardware Specifications

This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8250 PowerQUICC II? communications processor. The following topics are addressed: The MPC8250 is available in two packages—the standard TBGA package

文件：1.18005 Mbytes 頁數(shù)：62 Pages

恩XP

Hardware Specifications

This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8250 PowerQUICC II? communications processor. The following topics are addressed: The MPC8250 is available in two packages—the standard TBGA package

文件：1.18005 Mbytes 頁數(shù)：62 Pages

恩XP

Hardware Specifications

This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8250 PowerQUICC II? communications processor. The following topics are addressed: The MPC8250 is available in two packages—the standard TBGA package

文件：1.18005 Mbytes 頁數(shù)：62 Pages

恩XP

Hardware Specifications

This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8250 PowerQUICC II? communications processor. The following topics are addressed: The MPC8250 is available in two packages—the standard TBGA package

文件：1.18005 Mbytes 頁數(shù)：62 Pages

恩XP

Hardware Specifications

This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8250 PowerQUICC II? communications processor. The following topics are addressed: The MPC8250 is available in two packages—the standard TBGA package

文件：1.18005 Mbytes 頁數(shù)：62 Pages

恩XP

Hardware Specifications

This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8250 PowerQUICC II? communications processor. The following topics are addressed: The MPC8250 is available in two packages—the standard TBGA package

文件：1.18005 Mbytes 頁數(shù)：62 Pages

恩XP

CodeWarrior Development Studio

This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC8250 PowerQUICC II? communications processor. The following topics are addressed: The MPC8250 is available in two packages—the standard TBGA package (480

文件：956.48 Kbytes 頁數(shù)：2 Pages

FREESCALEFreescale Semiconductor, Inc

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Hardware Specifications

文件：1.07291 Mbytes 頁數(shù)：60 Pages

FREESCALEFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

Hardware Specifications

文件：1.07291 Mbytes 頁數(shù)：60 Pages

FREESCALEFreescale Semiconductor, Inc

飛思卡爾飛思卡爾半導(dǎo)體

PQ 2 HIP4 REV-C NO-PB

The PowerQUICC? II? integrated communications processor family delivers excellent integration of processing power for networking and communications peripherals, providing customers with an innovative, total system solution for building high-end communications systems. 恩XP? Semiconductors's PowerQUIC Product Highlights\n? 300 MHz high-speed embedded G2 core\n? Powerful memory controller and system functions\n? Enhanced 32-bit RISC communications processor module\n? Up to two multiport 10/100 Mbps ethernet MAC\n? Up to two UTOPIA II ATM interfaces\n? Up to 128 HDLC channels (each channel 64 Kbps,;

恩XP