The FlipStack? CSP family utilizes Amkor’s industry leading ChipArray? Ball Grid Array (CABGA) manufacturing capabilities

FEATURES Package height down to 0.6 mm Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices Established package infrastructure with standard CABGA and fcCSP footprints Consistent product performance with high yields and rel

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AMKOR

安靠科技

Silicon Complementary Transistors Audio Amplifier, Driver

Features: ● High Collector–Emitter Voltage ● Ideal for 25 – 30W Low–Frequency Output Drive

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NTE

GaAlAs Plastic Infrared Emitting Diodes

Plastic Infrared Emitting Diode OP290 Series Description: Each device in this series, is a gallium aluminum arsenide infrared Light Emitting Diode (LED) that is molded in an IR-transmissive package with a wavelength centered at 890 nm, which closely matches the spectral response of silicon photo

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OPTEK

GaAlAs Plastic Infrared Emitting Diodes

Plastic Infrared Emitting Diode OP290 Series Description: Each device in this series, is a gallium aluminum arsenide infrared Light Emitting Diode (LED) that is molded in an IR-transmissive package with a wavelength centered at 890 nm, which closely matches the spectral response of silicon photo

文件：505.76 Kbytes 頁數(shù)：4 Pages

OPTEK