The FlipStack? CSP family utilizes Amkor’s industry leading ChipArray? Ball Grid Array (CABGA) manufacturing capabilities

FEATURES Package height down to 0.6 mm Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices Established package infrastructure with standard CABGA and fcCSP footprints Consistent product performance with high yields and rel

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AMKOR

安靠科技

SOTM Transit Case System

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ULTRALIFE

Silicon NPN Transistor RF Power Amp/Driver, CB

Description: The NTE195A is designed primarily for use in large–signal output amplifier stages. Intended for use in Citizen–Band communications equipment operating to 30MHz. High breakdown voltages allow a high percentage of up–modulation in AM circuits. Features: ? Specified 12.5V, 28M

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NTE

MINITACTORTM

Features ? Hermetically sealed contactor ? Make/break switching up to 1200Vdc ? Best option for: NEC 690.11 and 690.12 DC arc fault interrupting and rapid shutdown requirements ? Small, lightweight and cost effective patented design ? Perfect choice for 600Vdc and 1000Vdc photovoltaic/batter

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SENSATA

森薩塔