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首頁(yè) >MH32>規(guī)格書列表

型號(hào)	下載訂購(gòu)	功能描述	制造商上傳企業(yè)	LOGO
MH32S72BBFA-6	文件：963.58 Kbytes Page：56 Pages	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a 文件：963.58 Kbytes 頁(yè)數(shù)：56 Pages	MITSUBISHI 三菱電機(jī)	MITSUBISHI
MH32S72BBFA-7	文件：964.49 Kbytes Page：56 Pages	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a 文件：964.49 Kbytes 頁(yè)數(shù)：56 Pages	MITSUBISHI 三菱電機(jī)	MITSUBISHI
MH32S72BBFA-8	文件：964.49 Kbytes Page：56 Pages	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72BBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a 文件：964.49 Kbytes 頁(yè)數(shù)：56 Pages	MITSUBISHI 三菱電機(jī)	MITSUBISHI
MH32S72DBFA-6	文件：952.25 Kbytes Page：56 Pages	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72DBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a 文件：952.25 Kbytes 頁(yè)數(shù)：56 Pages	MITSUBISHI 三菱電機(jī)	MITSUBISHI
MH32S72DBFA-7	文件：941.97 Kbytes Page：56 Pages	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72DBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a 文件：941.97 Kbytes 頁(yè)數(shù)：56 Pages	MITSUBISHI 三菱電機(jī)	MITSUBISHI
MH32S72DBFA-8	文件：941.97 Kbytes Page：56 Pages	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72DBFA is 33554432 - word x 72-bit Sy nchronous DRAM stacked structural module. This consist of thirty -six industry standard 16M x 4 Sy nchronous DRAMs in TSOP. The stacked structure of TSOP on a card edge dual inline package prov ides any application where high densities a 文件：941.97 Kbytes 頁(yè)數(shù)：56 Pages	MITSUBISHI 三菱電機(jī)	MITSUBISHI
MH32S72PHB-10	文件：595.07 Kbytes Page：55 Pages	2415919104-BIT (33554432 - WORD BY 72-BIT)SynchronousDRAM DESCRIPTION The MH32S72PHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den 文件：595.07 Kbytes 頁(yè)數(shù)：55 Pages	MITSUBISHI 三菱電機(jī)	MITSUBISHI
MH32S72PHB-6	文件：582.1 Kbytes Page：40 Pages	2,415,919,104-BIT ( 33,554,432-WORD BY 72-BIT ) Synchronous DYNAMIC RAM DESCRIPTION The MH32S72PHB is 33554432 - word x 72-bit Synchronous DRAM module. This consist of eighteen industry standard 16M x 8 Synchronous DRAMs in TSOP. The TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. T 文件：582.1 Kbytes 頁(yè)數(shù)：40 Pages	MITSUBISHI 三菱電機(jī)	MITSUBISHI
MH32S72PHB-7	文件：595.07 Kbytes Page：55 Pages	2415919104-BIT (33554432 - WORD BY 72-BIT)SynchronousDRAM DESCRIPTION The MH32S72PHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den 文件：595.07 Kbytes 頁(yè)數(shù)：55 Pages	MITSUBISHI 三菱電機(jī)	MITSUBISHI
MH32S72PHB-8	文件：595.07 Kbytes Page：55 Pages	2415919104-BIT (33554432 - WORD BY 72-BIT)SynchronousDRAM DESCRIPTION The MH32S72PHB is 33554432 - word by 72-bit Synchronous DRAM module. This consists of eighteen industry standard 16Mx8 Synchronous DRAMs in TSOP and one industory standard EEPROM in TSSOP. The mounting of TSOP on a card edge Dual Inline package provides any application where high den 文件：595.07 Kbytes 頁(yè)數(shù)：55 Pages	MITSUBISHI 三菱電機(jī)	MITSUBISHI

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技術(shù)參數(shù)

@TC0C：
3.0
VRM(V)：
150
IFSM(A)：
100
IR(uA)：
50
VF(V)：
5.0
TRR(nS)：
1.0
PACKAGE：
50
Download：
SMB

供應(yīng)商	型號(hào)	品牌	批號(hào)	封裝	庫(kù)存	備注	價(jià)格
深圳誠(chéng)思涵科技有限公司	MH32	MOSPEC	19+	SMB	200000		詢價(jià)
深圳市一線半導(dǎo)體有限公司	MH3292C38F16JA258S	MIT	24+	QFP	564		詢價(jià)
深圳市福安甌科技有限公司	MH3294F16	N/A	25+	QFP	2500	強(qiáng)調(diào)現(xiàn)貨,隨時(shí)查詢!	詢價(jià)
深圳市毅創(chuàng)騰電子科技有限公司	MH3278CP10	MITSUBIS	23+	PLCC	7000	絕對(duì)全新原裝!100%保質(zhì)量特價(jià)!請(qǐng)放心訂購(gòu)!	詢價(jià)
諦輝(北京/上海/青島 )電子科技有限公司	MH3292C38F16JA258S	MIT	25+	SOP-14	18000	原廠直接發(fā)貨進(jìn)口原裝	詢價(jià)
齊創(chuàng)科技(上海,北京,青島)有限公司	MH3292C38F16JA258S	MIT	23+	DIP16	5000	原裝正品,假一罰十	詢價(jià)
深圳市凌旭科技有限公司	MH3261-601Y	BOURNS	2016+	SMD	3000	只做原裝,假一罰十,公司可開17%增值稅發(fā)票!	詢價(jià)
深圳市豪邁興電子有限公司	MH3278CP10	HITACHI	24+	PLCC68	5632	公司原廠原裝現(xiàn)貨假一罰十!特價(jià)出售!強(qiáng)勢(shì)庫(kù)存!	詢價(jià)
芯有半導(dǎo)體（深圳）有限公司	MH3225HM601NT	N/A	411	N/A	1120	全新原裝現(xiàn)貨100真實(shí)自己公司	詢價(jià)
深圳市卓越微芯電子有限公司	MH3294F16	MITSUBI	25+	BULKQF	3505	百分百原裝正品真實(shí)公司現(xiàn)貨庫(kù)存本公司只做原裝可	詢價(jià)

更多MH32供應(yīng)商更新時(shí)間2026-1-22 10:31:00

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