| 型號(hào) | 下載 訂購(gòu) | 功能描述 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
High Precision Thin Film Chip Resistors Full Reels Description The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive layer that is applied to the top surface of the substrate. The composition of the resistive layer is adjusted to give the approxima 文件：1.01939 Mbytes 頁(yè)數(shù)：10 Pages | MULTICOMP 易絡(luò)盟 | MULTICOMP | ||
High Precision Thin Film Chip Resistors Full Reels Description The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive layer that is applied to the top surface of the substrate. The composition of the resistive layer is adjusted to give the approxima 文件：1.01939 Mbytes 頁(yè)數(shù)：10 Pages | MULTICOMP 易絡(luò)盟 | MULTICOMP | ||
High Precision Thin Film Chip Resistors Full Reels Description The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive layer that is applied to the top surface of the substrate. The composition of the resistive layer is adjusted to give the approxima 文件：1.01939 Mbytes 頁(yè)數(shù)：10 Pages | MULTICOMP 易絡(luò)盟 | MULTICOMP | ||
High Precision Thin Film Chip Resistors Full Reels Description The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive layer that is applied to the top surface of the substrate. The composition of the resistive layer is adjusted to give the approxima 文件：1.01939 Mbytes 頁(yè)數(shù)：10 Pages | MULTICOMP 易絡(luò)盟 | MULTICOMP | ||
High Precision Thin Film Chip Resistors Full Reels Description The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive layer that is applied to the top surface of the substrate. The composition of the resistive layer is adjusted to give the approxima 文件：1.01939 Mbytes 頁(yè)數(shù)：10 Pages | MULTICOMP 易絡(luò)盟 | MULTICOMP | ||
High Precision Thin Film Chip Resistors Full Reels Description The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive layer that is applied to the top surface of the substrate. The composition of the resistive layer is adjusted to give the approxima 文件：1.01939 Mbytes 頁(yè)數(shù)：10 Pages | MULTICOMP 易絡(luò)盟 | MULTICOMP | ||
High Precision Thin Film Chip Resistors Full Reels Description The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive layer that is applied to the top surface of the substrate. The composition of the resistive layer is adjusted to give the approxima 文件：1.01939 Mbytes 頁(yè)數(shù)：10 Pages | MULTICOMP 易絡(luò)盟 | MULTICOMP | ||
High Precision Thin Film Chip Resistors Full Reels Description The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive layer that is applied to the top surface of the substrate. The composition of the resistive layer is adjusted to give the approxima 文件：1.01939 Mbytes 頁(yè)數(shù)：10 Pages | MULTICOMP 易絡(luò)盟 | MULTICOMP | ||
High Precision Thin Film Chip Resistors Full Reels Description The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive layer that is applied to the top surface of the substrate. The composition of the resistive layer is adjusted to give the approxima 文件：1.01939 Mbytes 頁(yè)數(shù)：10 Pages | MULTICOMP 易絡(luò)盟 | MULTICOMP | ||
High Precision Thin Film Chip Resistors Full Reels Description The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive layer that is applied to the top surface of the substrate. The composition of the resistive layer is adjusted to give the approxima 文件：1.01939 Mbytes 頁(yè)數(shù)：10 Pages | MULTICOMP 易絡(luò)盟 | MULTICOMP |
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