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          首頁 >MBF>規(guī)格書列表

          型號下載 訂購功能描述制造商 上傳企業(yè)LOGO

          MBF110PFW1STES

          Solid-State Fingerprint Sensor

          Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate

          文件:240.26 Kbytes 頁數(shù):24 Pages

          FUJITSU

          富士通

          MBF110PFW1STG

          Solid-State Fingerprint Sensor

          Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate

          文件:240.26 Kbytes 頁數(shù):24 Pages

          FUJITSU

          富士通

          MBF110PFWLPES

          Solid-State Fingerprint Sensor

          Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate

          文件:240.26 Kbytes 頁數(shù):24 Pages

          FUJITSU

          富士通

          MBF110PFWLPG

          Solid-State Fingerprint Sensor

          Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate

          文件:240.26 Kbytes 頁數(shù):24 Pages

          FUJITSU

          富士通

          MBF110PFWSTES

          Solid-State Fingerprint Sensor

          Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate

          文件:240.26 Kbytes 頁數(shù):24 Pages

          FUJITSU

          富士通

          MBF110PFWSTG

          Solid-State Fingerprint Sensor

          Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate

          文件:240.26 Kbytes 頁數(shù):24 Pages

          FUJITSU

          富士通

          MBF15M

          絲?。?a target="_blank" title="Marking" href="/mbf15m/marking.html">MBF15M;Package:MBF;Silicon Bridge Rectifiers

          Features ● Glass passivated junction ● High surge current capability ● Saves space on printed circuit boards ● High temperature soldering guaranteed: 260°C/10 seconds ● RoHS Compliant Mechanical Data ● Case: Molded plastic body RoHS-compliant ● Molding compound meets UL 94 V-0 flammability

          文件:768.73 Kbytes 頁數(shù):4 Pages

          BILIN

          銀河微電

          MBF15T65PEH

          絲?。?a target="_blank" title="Marking" href="/15t65peh/marking.html">15T65PEH;Package:TO-220F;650V Field Stop IGBT

          General Description This IGBT is produced using advanced MagnaChip’s Field Stop Trench IGBT Technology, which provides high performance, excellent quality and high ruggedness. This device is for motor control. Features ■ High ruggedness for motor control ■ VCE(sat) positive temperature coeffi

          文件:649.99 Kbytes 頁數(shù):8 Pages

          MGCHIP

          MBF2-MBF10

          Low profile package

          Features ◇ Low profile package ◇ Ideal for automated placement ◇ Ultrafast reverse recovery time ◇ Low power losses, high efficiency ◇ Low forward voltage drop ◇ High surge capability ◇ High temperature soldering: 260℃/10 seconds at terminals

          文件:526.6 Kbytes 頁數(shù):2 Pages

          LUGUANG

          魯光電子

          MBF2-MBF10

          Low profile package

          Features ◇ Low profile package ◇ Ideal for automated placement ◇ Ultrafast reverse recovery time ◇ Low power losses, high efficiency ◇ Low forward voltage drop ◇ High surge capability ◇ High temperature soldering: 260℃/10 seconds at terminals

          文件:526.6 Kbytes 頁數(shù):2 Pages

          LUGUANG

          魯光電子

          產(chǎn)品屬性

          • 產(chǎn)品編號:

            MBF

          • 制造商:

            TE Connectivity Laird

          • 類別:

            RF/IF,射頻/中頻和 RFID > RF 配件

          • 包裝:

            散裝

          • 配件類型:

            安裝

          • 描述:

            ACCY MOUNT BMM 3/4\

          供應(yīng)商型號品牌批號封裝庫存備注價(jià)格
          LAIRD
          25+
          射頻元件
          155
          就找我吧!--邀您體驗(yàn)愉快問購元件!
          詢價(jià)
          OKI
          25+
          SSOP56
          18000
          原廠直接發(fā)貨進(jìn)口原裝
          詢價(jià)
          MOTOROLA
          24+
          69000
          現(xiàn)貨供應(yīng)
          詢價(jià)
          HITACHI
          23+
          模塊
          350
          全新原裝正品,量大可訂貨!可開17%增值票!價(jià)格優(yōu)勢!
          詢價(jià)
          ASJ
          06+
          原廠原裝
          9216
          只做全新原裝真實(shí)現(xiàn)貨供應(yīng)
          詢價(jià)
          MOTOROLA
          24+
          CAN
          280
          原裝現(xiàn)貨假一罰十
          詢價(jià)
          OKI
          23+
          CAN3
          5000
          原裝正品,假一罰十
          詢價(jià)
          OKI
          24+
          QFN
          6980
          原裝現(xiàn)貨,可開13%稅票
          詢價(jià)
          FUJ
          24+
          SSOP
          4652
          公司原廠原裝現(xiàn)貨假一罰十!特價(jià)出售!強(qiáng)勢庫存!
          詢價(jià)
          MICROGATA
          2016+
          SMD
          9000
          只做原裝,假一罰十,公司可開17%增值稅發(fā)票!
          詢價(jià)
          更多MBF供應(yīng)商 更新時(shí)間2021-9-14 10:50:00
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