| 型號 | 下載 訂購 | 功能描述 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate 文件:240.26 Kbytes 頁數(shù):24 Pages | FUJITSU 富士通 | FUJITSU | ||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate 文件:240.26 Kbytes 頁數(shù):24 Pages | FUJITSU 富士通 | FUJITSU | ||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate 文件:240.26 Kbytes 頁數(shù):24 Pages | FUJITSU 富士通 | FUJITSU | ||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate 文件:240.26 Kbytes 頁數(shù):24 Pages | FUJITSU 富士通 | FUJITSU | ||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate 文件:240.26 Kbytes 頁數(shù):24 Pages | FUJITSU 富士通 | FUJITSU | ||
Solid-State Fingerprint Sensor Overview The Fujitsu MBF110 Solid-State Fingerprint Sensor is a direct contact, fingerprint acquisition device. It is a high performance, low power, low cost, capacitive sensor with an integrated twodimensional array of metal electrodes in the sensing array. Each metal electrode acts as one plate 文件:240.26 Kbytes 頁數(shù):24 Pages | FUJITSU 富士通 | FUJITSU | ||
絲?。?a target="_blank" title="Marking" href="/mbf15m/marking.html">MBF15M;Package:MBF;Silicon Bridge Rectifiers Features ● Glass passivated junction ● High surge current capability ● Saves space on printed circuit boards ● High temperature soldering guaranteed: 260°C/10 seconds ● RoHS Compliant Mechanical Data ● Case: Molded plastic body RoHS-compliant ● Molding compound meets UL 94 V-0 flammability 文件:768.73 Kbytes 頁數(shù):4 Pages | BILIN 銀河微電 | BILIN | ||
絲?。?a target="_blank" title="Marking" href="/15t65peh/marking.html">15T65PEH;Package:TO-220F;650V Field Stop IGBT General Description This IGBT is produced using advanced MagnaChip’s Field Stop Trench IGBT Technology, which provides high performance, excellent quality and high ruggedness. This device is for motor control. Features ■ High ruggedness for motor control ■ VCE(sat) positive temperature coeffi 文件:649.99 Kbytes 頁數(shù):8 Pages | MGCHIP | MGCHIP | ||
Low profile package Features ◇ Low profile package ◇ Ideal for automated placement ◇ Ultrafast reverse recovery time ◇ Low power losses, high efficiency ◇ Low forward voltage drop ◇ High surge capability ◇ High temperature soldering: 260℃/10 seconds at terminals 文件:526.6 Kbytes 頁數(shù):2 Pages | LUGUANG 魯光電子 | LUGUANG | ||
Low profile package Features ◇ Low profile package ◇ Ideal for automated placement ◇ Ultrafast reverse recovery time ◇ Low power losses, high efficiency ◇ Low forward voltage drop ◇ High surge capability ◇ High temperature soldering: 260℃/10 seconds at terminals 文件:526.6 Kbytes 頁數(shù):2 Pages | LUGUANG 魯光電子 | LUGUANG |
產(chǎn)品屬性
- 產(chǎn)品編號:
MBF
- 制造商:
TE Connectivity Laird
- 類別:
RF/IF,射頻/中頻和 RFID > RF 配件
- 包裝:
散裝
- 配件類型:
安裝
- 描述:
ACCY MOUNT BMM 3/4\
| 供應(yīng)商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價(jià)格 |
|---|---|---|---|---|---|---|---|
LAIRD |
25+ |
射頻元件 |
155 |
就找我吧!--邀您體驗(yàn)愉快問購元件! |
詢價(jià) | ||
OKI |
25+ |
SSOP56 |
18000 |
原廠直接發(fā)貨進(jìn)口原裝 |
詢價(jià) | ||
MOTOROLA |
24+ |
69000 |
現(xiàn)貨供應(yīng) |
詢價(jià) | |||
HITACHI |
23+ |
模塊 |
350 |
全新原裝正品,量大可訂貨!可開17%增值票!價(jià)格優(yōu)勢! |
詢價(jià) | ||
ASJ |
06+ |
原廠原裝 |
9216 |
只做全新原裝真實(shí)現(xiàn)貨供應(yīng) |
詢價(jià) | ||
MOTOROLA |
24+ |
CAN |
280 |
原裝現(xiàn)貨假一罰十 |
詢價(jià) | ||
OKI |
23+ |
CAN3 |
5000 |
原裝正品,假一罰十 |
詢價(jià) | ||
OKI |
24+ |
QFN |
6980 |
原裝現(xiàn)貨,可開13%稅票 |
詢價(jià) | ||
FUJ |
24+ |
SSOP |
4652 |
公司原廠原裝現(xiàn)貨假一罰十!特價(jià)出售!強(qiáng)勢庫存! |
詢價(jià) | ||
MICROGATA |
2016+ |
SMD |
9000 |
只做原裝,假一罰十,公司可開17%增值稅發(fā)票! |
詢價(jià) |
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- NE5532
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