Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·Return Loss > 16 dB 13 to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Flat Response From DC to 40 GHz\n·Medium Power Handling 2W CW\n·DC to 40 GHz\n·Very Good Stability Over Temperature (TCR < 100 PPM)\n·Space Saving Footprint .030” X .030” (762 X .762mm)\n·Ground Wrap to Top (No ground bond;

MACOM

Attenuator DIE

文件：460.03 Kbytes 頁(yè)數(shù)：3 Pages

MA-COM

Package：模具；包裝：卷帶（TR）剪切帶（CT）Digi-Reel? 得捷定制卷帶 類別：RF/IF，射頻/中頻和 RFID 衰減器 描述：ATTENUATOR,DIE,29DB

MACOM Technology Solutions

Nylon PCB Supports - Imperial Spacing

文件：106.11 Kbytes 頁(yè)數(shù)：1 Pages

HEYCO

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ETCList of Unclassifed Manufacturers

未分類制造商

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文件：141.96 Kbytes 頁(yè)數(shù)：2 Pages

HAMAMATSUHamamatsu Photonics Co.,Ltd.

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