Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·DC to 40 GHz\n·Space Saving Footprint .030” X .030” (762 X .762mm)\n·Return Loss > 16 dB 13 to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Flat Response From DC to 40 GHz\n·Medium Power Handling 2W CW\n·Ground Wrap to Top (No ground bonding required)\n·Very Good Stability Over Temperature (TCR < 10;

MACOM

Attenuator DIE

文件：460.03 Kbytes 頁數(shù)：3 Pages

MA-COM

PRODUCT SPECIFICATION

文件：395.81 Kbytes 頁數(shù)：6 Pages

JOKARI

PRODUCT SPECIFICATION

Cable/Wire stripperss

文件：728.81 Kbytes 頁數(shù)：14 Pages

JOKARI

Aluminium Housed Power Resistors

文件：120.06 Kbytes 頁數(shù)：3 Pages

MACOM