Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·Return Loss > 16 dB 13 to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Flat Response From DC to 40 GHz\n·Medium Power Handling 2W CW\n·DC to 40 GHz\n·Ground Wrap to Top (No ground bonding required)\n·Very Good Stability Over Temperature (TCR < 100 PPM)\n·Space Saving Footprint .030” X .030” (;

MACOM

Attenuator DIE

文件：460.03 Kbytes 頁數(shù)：3 Pages

MA-COM

Package：模具；包裝：盒 類別：RF/IF，射頻/中頻和 RFID 衰減器 描述：ATTENUATOR,DIE,23DB

MACOM Technology Solutions

NBF-SERIES NEMA ECONOMY ENCLOSURES

文件：82.94 Kbytes 頁數(shù)：4 Pages

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NBF-SERIES NEMA ECONOMY ENCLOSURES

文件：82.94 Kbytes 頁數(shù)：4 Pages

BUD

Single Dual T1/CEPT Transformers

T1/CEPT PULSE TRANSFORMER Flammability: Materials used in the production of these units meet requirements of UL94-VO and IEC 695-2-2 needle flame test.

文件：81.23 Kbytes 頁數(shù)：1 Pages

RHOMBUS-IND