Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·Space Saving Footprint .030” X .030” (762 X .762mm)\n·Return Loss > 16 dB 13 to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Flat Response From DC to 40 GHz\n·Medium Power Handling 2W CW\n·DC to 40 GHz\n·Very Good Stability Over Temperature (TCR < 100 PPM)\n·Ground Wrap to Top (No ground bond;

MACOM

Attenuator DIE

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MA-COM

Package：模具；包裝：卷帶（TR）剪切帶（CT）Digi-Reel? 得捷定制卷帶 類別：RF/IF，射頻/中頻和 RFID 衰減器 描述：RF ATTENUATOR 15DB DIE

MACOM Technology Solutions

MBR10150 SCHOTTKY RECTIFIER

Features 175?C TJ operation Low forward voltage drop High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance High frequency operation Guard ring for enhanced ruggedness and long term reliability This is a Pb ? Free Device All SMC parts a

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SMCDIODE

桑德斯微電子

10.0 AMPS. Schottky Barrier Rectifiers

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TSC

臺(tái)灣半導(dǎo)體

Wide Temperature Range and High Tjm Schottky Barrier Rectifiers

FEATURES * International standard package * Very low VF * Extremely low switching losses * Low IRM-values APPLICATIONS * Rectifiers in switch mode power supplies (SMPS) * Free wheeling diode in low voltage converters ADVANTAGES * High reliability circuit operation * Low voltage peaks for

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SIRECTIFIER

矽萊克電子