Thin Film Attenuator Pads

MACOM attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped around on the four corners of the chip so additional ground ·RoHS\n·DC to 40 GHz\n·Medium Power Handling 2W CW\n·Flat Response From DC to 40 GHz\n·Space Saving Footprint .030” X .030” (762 X .762mm)\n·Return Loss > 16 dB 13 to 40 GHz\n·Return Loss > 18 dB DC to 12 GHz\n·Ground Wrap to Top (No ground bonding required)\n·Very Good Stability Over Temperature (T;

MACOM

Attenuator DIE

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MA-COM

Package：模具；包裝：卷帶（TR）剪切帶（CT）Digi-Reel? 得捷定制卷帶 類別：RF/IF，射頻/中頻和 RFID 衰減器 描述：RF ATTENUATOR 14DB DIE

MACOM Technology Solutions

CCD area image sensor Low readout noise, high resolution (pixel size: 12 關(guān)m)

S10140/S10141 series is a family of back-thinned FFT-CCD image sensors specifically designed for low-light-level detection in scientific applications. By using the binning operation, S10140/S0141 series can be used as a linear image sensor having a long aperture in the direction of the device leng

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HAMAMATSUHamamatsu Photonics Co.,Ltd.

濱松光子濱松光子學株式會社

Thyristor Discretes (SCRs)

文件：340.71 Kbytes 頁數(shù)：2 Pages

SIRECTIFIER

矽萊克電子

ULTRA FAST RECOVERY RECTIFIERS

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MICROSEMI

美高森美